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  die-46 Datasheet PDF File

For die-46 Found Datasheets File :: 9152    Search Time::2.797ms    
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    BGY916

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. BGY916
OCR Text ...e NPN silicon planar transistor die and two silicon MOS-FET dies mounted on a metallized ceramic AlN substrate, together with matching and b...46 c 0.3 0.2 D 30.1 29.9 d 12.8 12.6 E 18.6 18.4 e e1 F 3.25 3.15 L 6.5 6.1 P 4.1 3.9 Q 4.0 3.8 q U ...
Description UHF amplifier module

File Size 87.94K  /  12 Page

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    CF5732EA CF5732FA CF5732GA CF5732HA CF5732JA CF5732KA

Nippon Precision Circui...
NPC[Nippon Precision Circuits Inc]
Part No. CF5732EA CF5732FA CF5732GA CF5732HA CF5732JA CF5732KA
OCR Text ...e 1.5 V supply - Available as a die SERIES LINEUP CF5732EA Built-in Capacitor XT terminal CG(pF) XT terminal CD(pF) C1(pF) C2(pF) C4(pF)...46.875 L Yes(1/2VDD) AO H 2048 8+1 1.0 AO L(*2) 2048 8+1 11.5 29 6 7 8 9 0.125 DUTY50% L Yes(1/2V...
Description Analog clock CMOS IC

File Size 41.23K  /  6 Page

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    CPC1008 CPC1008N CPC1008NTR

Clare Inc
CLARE[Clare, Inc.]
Clare Inc.
Part No. CPC1008 CPC1008N CPC1008NTR
OCR Text ...OSFET switches and photovoltaic die use Clare's patented OptoMOS(R) architecture. The optically-coupled input is controlled by a highly effi...46-862-10370 Fax: 46-862-10371 United Kingdom Clare UK Sales Marco Polo House Cook Way Bindon Road T...
Description 4 Pin SOP OptoMOS Relay TRANSISTOR OUTPUT SOLID STATE RELAY, 1500 V ISOLATION-MAX

File Size 185.14K  /  6 Page

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    EHD66764

HITACHI[Hitachi Semiconductor]
Part No. EHD66764
OCR Text ...66764BP External Appearance TCP Die with Au bump 2 HD66764 HD66764 PAD arrangement DUMMY100 DUMMY101 No.341 No.1 DYMMY1 DUMMY2 D...46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 pad name DUMMY1 DUMMY2 DUMMY3 DUMMY4 DUMMY5 RESET CDA C...
Description 176-channel Common Driver for Color Displays

File Size 247.11K  /  38 Page

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    HCPL-6231 HCPL-5200 HCPL-5201 HCPL-520K HCPL-520X HCPL-5230 HCPL-5231 HCPL-523K HCPL-523X 5962-88768 5962-88769 HCPL-625

HP[Agilent(Hewlett-Packard)]
Agilent (Hewlett-Packard)
Part No. HCPL-6231 HCPL-5200 HCPL-5201 HCPL-520K HCPL-520X HCPL-5230 HCPL-5231 HCPL-523K HCPL-523X 5962-88768 5962-88769 HCPL-6251 HCPL-625X HCPL-623K HCPL-6250 HCPL-623X HCPL-6230 HCPL-625K
OCR Text ...le. Because the same electrical die (emitters and detectors) are used for each channel of each device listed in this data sheet, absolute ma...46 (0.018) 0.36 (0.014) 8.13 (0.320) MAX. 2.85 (0.112) MAX. 0.88 (0.0345) MIN. 0.89 (0.035) 0....
Description Hermetically Sealed/ Low IF/ Wide VCC/ Logic Gate Optocouplers
Hermetically Sealed, Low IF, Wide VCC, Logic Gate Optocouplers
Hermetically Sealed Low IF Wide VCC Logic Gate Optocouplers

File Size 258.42K  /  12 Page

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    IRF640 IRF640S

PHILIPS[Philips Semiconductors]
NXP Semiconductors
Part No. IRF640 IRF640S
OCR Text ... load Measured tab to centre of die Measured from drain lead to centre of die (SOT78 package only) Measured from source lead to source bond ...46 D max. 11 D1 1.60 1.20 E 10.30 9.70 e 2.54 Lp 2.90 2.10 HD 15.40 14.80 Q 2.60 2.20 OUTLINE VER...
Description N-channel TrenchMOS transistor(N娌?? TrenchMOS ?朵?绠?
N-channel TrenchMOS transistor(N沟道 TrenchMOS 晶体
N-channel TrenchMOS TM transistor

File Size 93.86K  /  9 Page

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    IRL5602S IRF530S IRL5602STRR IRL5602STRL

IRF[International Rectifier]
Part No. IRL5602S IRF530S IRL5602STRR IRL5602STRL
OCR Text ...ackage capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any...46 (.018) MINIMUM RECOMMENDED FOOTPRINT 11.43 (.450) NOTES: 1 DIMENSIONS AFTER SOLDER DIP. 2 D...
Description -20V Single P-Channel HEXFET Power MOSFET in a D2-Pak package

File Size 169.26K  /  8 Page

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    K4S280832E-TC75 K4S280832E-TL75 K4S281632E-TC60 K4S281632E-TC75 K4S281632E-TL60 K4S281632E-TL75 K4S281632F-TC60 K4S28163

Samsung Electronic
Samsung semiconductor
Part No. K4S280832E-TC75 K4S280832E-TL75 K4S281632E-TC60 K4S281632E-TC75 K4S281632E-TL60 K4S281632E-TL75 K4S281632F-TC60 K4S281632F-TC75 K4S281632F-TL60 K4S281632F-TL75 K4S280432E-TC75 K4S280432E-TL75
OCR Text die (x4, x8, x16) CMOS SDRAM 128Mb E-die SDRAM Specification Revision 1.2 May. 2003 * Samsung Electronics reserves the right to ...46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 x4 VSS N.C VSSQ N.C DQ3 VDDQ N.C N.C VS...
Description 128Mb F-die SDRAM Specification
128Mb E-die SDRAM Specification

File Size 142.11K  /  14 Page

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    K4S280832F-TC75 K4S280832F-TL75 K4S281632F-TC60 K4S281632F-TC75 K4S281632F-TL60 K4S281632F-TL75 TL431CDT K4S280432F-TCL7

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S280832F-TC75 K4S280832F-TL75 K4S281632F-TC60 K4S281632F-TC75 K4S281632F-TL60 K4S281632F-TL75 TL431CDT K4S280432F-TCL75 K4S280832F-TCL75 K4S280432F-TC75 K4S281632F-TCL60 K4S281632F-TCL75 K4S280432F-TL75
OCR Text die (x4, x8, x16) Preliminary CMOS SDRAM 128Mb F-die SDRAM Specification Revision 0.2 November. 2003 * Samsung Electronics reser...46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 Preliminary CMOS SDRAM x4 VSS N.C VS...
Description 128Mb F-die SDRAM Specification 128Mb的的F - SDRAM内存芯片规格

File Size 143.50K  /  14 Page

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    K4S510832B-TC75 K4S510832B-TCL75 K4S510432B-TC K4S510432B-TC75 K4S510432B-TCL75 K4S511632B-TC75 K4S511632B-TCL75

Samsung Electronic
SAMSUNG[Samsung semiconductor]
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4S510832B-TC75 K4S510832B-TCL75 K4S510432B-TC K4S510432B-TC75 K4S510432B-TCL75 K4S511632B-TC75 K4S511632B-TCL75
OCR Text die (x4, x8, x16) CMOS SDRAM 512Mb B-die SDRAM Specification Revision 1.1 February 2004 * Samsung Electronics reserves the right...46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 CMOS SDRAM x4 VSS N.C VSSQ N.C DQ3 V...
Description 512Mb B-die SDRAM Specification

File Size 147.30K  /  15 Page

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For die-46 Found Datasheets File :: 9152    Search Time::2.797ms    
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