| |
|
 |
TY Semiconductor Co., Ltd
|
| Part No. |
HSM88AS
|
| Description |
MPAK package is suitable for high density surface mounting and high speed assembly
|
| File Size |
55.86K /
1 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
QuickLogic, Corp.
QuickLogic Corp.
|
| Part No. |
QL3040-4PB456C QL3040-3PQ208I QL3040-2PB456I QL3040-1PQ208C QL3040-1PQ208I
|
| Description |
40,000 usable PLD gate pASIC 3 FPGA combining high performance and high density.
40000 usable PLD gate pASIC 3 FPGA combining high performance and high density FPGA, 1008 CLBS, 40000 GATES, 225 MHz, PBGA456
40000 usable PLD gate pASIC 3 FPGA combining high performance and high density FPGA, 1008 CLBS, 40000 GATES, 225 MHz, PQFP208
|
| File Size |
212.63K /
19 Page |
View
it Online |
Download Datasheet |
|
Price and Availability
|
