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ST Microelectronics, Inc.
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| Part No. |
ESDALC6V1-1BT2
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| OCR Text |
... capacitance TRANSIL diode Very thin package: 0.4 mm max. Bidirectional ESD protection Breakdown Voltage VBR = 6.1 V min. Low diode capacita...profile
Figure 16. ST ECOPACK recommended soldering reflow profile for PCB mounting
Temperature (C... |
| Description |
TVS Clamping Arrays
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| File Size |
148.38K /
10 Page |
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it Online |
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http:// HIROSE[Hirose Electric] Hirose Electric USA, INC.
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| Part No. |
ID1A-6S-2.54SF21 ID1A-6S-2.54SF
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| OCR Text |
Thin
Plecement surface
17 .4
30. 6
2.45
Photograph (1)
sFeatures
1. Suited for Plug-in SIM Cards of the GSM Standard (11.11...profile Manual soldering: 300c for 3 seconds
Note 1: Includes temperature rise caused by current ... |
| Description |
SIM Card Sockets
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| File Size |
238.02K /
7 Page |
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it Online |
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MAXIM - Dallas Semiconductor MAXIM[Maxim Integrated Products]
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| Part No. |
MAX1747 MAX1747EUP
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| OCR Text |
...Fast Transient Response o Ultra-Thin Solution (No Inductors) o Thin TSSOP Package (1.1mm max)
The MAX1747 triple charge-pump DC-DC conver...profile TSSOP package. One highpower and two low-power charge pumps convert the +2.7V to +4.5V input... |
| Description |
Triple Charge-Pump TFT LCD DC-DC Converter
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| File Size |
397.85K /
13 Page |
View
it Online |
Download Datasheet
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Price and Availability
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