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  TIM-5510 Datasheet PDF File

For TIM-5510 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

    TIM1414-8-252

Toshiba Semiconductor
Part No. TIM1414-8-252
Description HIGH POWER P1dB=39.0 dBm at 13.75 GHz to 14.5 GHz

File Size 120.32K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-T1109LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 9 Positions, 2.54 mm Pitch, Right Angle
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    TIM5359-8UL

Toshiba Semiconductor
Part No. TIM5359-8UL
Description HIGH POWER P1dB=39.5dBm at 5.3GHz to 5.9GHz

File Size 96.16K  /  4 Page

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Amphenol Communications Solutions

Part No. 55102-G1110LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 20 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TIM3742-4SL

Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
Part No. TIM3742-4SL
Description MICROWAVE POWER GAAS FET

File Size 121.66K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-T1108LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 8 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TIM1414-2-252

Toshiba Semiconductor
Part No. TIM1414-2-252
Description HIGH POWER P1dB=33.0 dBm at 13.75 GHz to 14.5 GHz

File Size 145.70K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-S3620LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 20 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TIM1414-4-252

Toshiba Semiconductor
Part No. TIM1414-4-252
Description MICROWAVE POWER GaAs FET

File Size 145.87K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-G17-04
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 4 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TIM1112-4UL

Toshiba Semiconductor
Part No. TIM1112-4UL
Description MICROWAVE POWER GaAs FET

File Size 107.06K  /  2 Page

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Amphenol Communications Solutions

Part No. 55101-T1104LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 4 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TIM1414-5-252

Toshiba Semiconductor
Part No. TIM1414-5-252
Description POWER GAAS FET

File Size 119.45K  /  5 Page

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Amphenol Communications Solutions

Part No. 55101-T1113LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 13 Positions, 2.54 mm Pitch, Right Angle
Tech specs    

Official Product Page

    TIM1213-15L

Toshiba Semiconductor
Part No. TIM1213-15L
Description MICROWAVE POWER GaAs FET

File Size 133.67K  /  4 Page

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Amphenol Communications Solutions

Part No. 55102-G1703LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 6 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TIM3742-8UL

Toshiba Corporation
Toshiba Semiconductor
Part No. TIM3742-8UL
Description MICROWAVE POWER GaAs FET

File Size 68.81K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-S1120LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 20 Positions, 2.54 mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

   
Part No. TIM1414-5-252
Description KU BAND, GaAs, N-CHANNEL, RF POWER, MOSFET

File Size 145.81K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-T1102LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 2 Positions, 2.54 mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

For TIM-5510 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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