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  4.8x0.8mm Datasheet PDF File

For 4.8x0.8mm Found Datasheets File :: 142    Search Time::1.422ms    
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    BL-HE136D-TRB

Bright LED Electronics Corp.
Part No. BL-HE136D-TRB
OCR Text ...ater Clear. 3. Mono-color type. 4. 1.6x0.8x0.8mm(0603) standard package. 5. Suitable for all SMT assembly methods. 6. Compatible with infrared and vapor phase reflow solder process. 7. Compatible with automatic placement equipment. 8. This ...
Description Hi-Eff Red Suitable for all SMT assembly methods.

File Size 207.19K  /  7 Page

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    BL-HD036D-TRB

Bright LED Electronics, Corp.
Bright LED Electronics Corp.
Part No. BL-HD036D-TRB
OCR Text ...ater Clear. 3. Mono-color type. 4. 1.6x0.8x0.8mm(0603) standard package. 5. Suitable for all SMT assembly methods. 6. Compatible with infrared and vapor phase reflow solder process. 7. Compatible with automatic placement equipment. 8. This ...
Description Super Red Suitable for all SMT assembly methods. 超级红适合所有SMT组装方法

File Size 208.07K  /  7 Page

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    http://
SEOUL[Seoul Semiconductor]
Part No. SSC-YG101
OCR Text ...Electro-optical characteristics 4. Characteristic diagram 5. Soldering profile 6. Outline dimension 7. Packing 8. Reel packing structure 9. ...8x0.8mm Untinted, Diffused flat mold Wavelength : 572 2. Absolute Maximum Ratings Parameter Power...
Description CHIP LED DEVICE

File Size 314.52K  /  7 Page

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    Seoul Semicondutctor, Inc.
Seoul Semicondutctor Inc.
SEOUL[Seoul Semiconductor]
Part No. SSC-YG101-IC1
OCR Text ...Electro-optical characteristics 4. Characteristic diagram 5. Soldering profile 6. Outline dimension 7. Packing 8. Reel packing structure 9. ...8x0.8mm Untinted, Diffused flat mold Wavelength : 572 2. Absolute Maximum Ratings Parameter Power...
Description CHIP LED DEVICE 芯片发光器件

File Size 306.18K  /  7 Page

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    Seoul Semicondutctor Inc.
SEOUL[Seoul Semiconductor]
Part No. SSC-YE101-IG0
OCR Text ...Electro-optical characteristics 4. Characteristic diagram 5. Soldering profile 6. Outline dimension 7. Packing 8. Reel packing structure 9. ...8x0.8mm Untinted, Diffused flat mold Wavelength : 587 2. Absolute Maximum Ratings Parameter Power...
Description CHIP LED DEVICE

File Size 384.57K  /  7 Page

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    Seoul Semicondutctor Inc.
SEOUL[Seoul Semiconductor]
Part No. SSC-UY101-IE1
OCR Text ...Electro-optical characteristics 4. Characteristic diagram 5. Soldering profile 6. Outline dimension 7. Packing 8. Reel packing structure 9. ...8x0.8mm Untinted, Diffused flat mold Wavelength : 593 2. Absolute Maximum Ratings Parameter Power...
Description CHIP LED DEVICE

File Size 384.16K  /  7 Page

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    SEOUL[Seoul Semiconductor]
Part No. SSC-GR101
OCR Text ...Electro-optical characteristics 4. Characteristic diagram 5. Soldering profile 6. Outline dimension 7. Packing 8. Reel packing structure 9. ...8x0.8mm Untinted, Diffused flat mold Wavelength : 570 2. Absolute Maximum Ratings Parameter Power...
Description CHIP LED DEVICE

File Size 385.07K  /  7 Page

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    SEOUL[Seoul Semiconductor]
Part No. SSC-AM101
OCR Text ...Electro-optical characteristics 4. Characteristic diagram 5. Soldering profile 6. Outline dimension 7. Packing 8. Reel packing structure 9. ...8x0.8mm Untinted, Diffused flat mold Wavelength : 605 2. Absolute Maximum Ratings Parameter Power...
Description CHIP LED DEVICE

File Size 310.29K  /  7 Page

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    Cosmo Electronics
COSMO[COSMO Electronics Corporation]
Part No. KL197T02
OCR Text ... 525 470 20 35 30 1.9 3.0 3.5 2.4 3.5 4.0 100 A VR = 5V V IF = 20mA nm nm deg Note 2 IF = 20mA Note 3 mcd Test Condition Luminous Intensity IF = 20mA Note 1 Note : 1. Luminous intensity is measured with a photo detector and filter...
Description LED, SMD
SMD LED

File Size 249.97K  /  9 Page

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