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  70567-0018 Datasheet PDF File

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    15-80-0129 0015800129 A-70567-0276

Molex Electronics Ltd.
Part No. 15-80-0129 0015800129 A-70567-0276
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
Molex Electronics Ltd.

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Amphenol Cables on Demand

Part No. CS-DSDHD44MF0-001.8M
Description Amphenol CS-DSDHD44MF0-001.8M 44-Pin (HD44) Deluxe HD D-Sub Cable - Copper Shielded - Male / Female 1.8m (6-feet)
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    15-80-0105 0015800105 A-70567-0139

Molex Electronics Ltd.
Part No. 15-80-0105 0015800105 A-70567-0139
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
Molex Electronics Ltd.

File Size 1,218.43K  /  7 Page

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Amphenol Communications Solutions

Part No. 10060018-10202TLF
Description PCI Express® GEN 1 Card Edge, Storage and Server Connector, Vertical, Press-Fit, x8, 98 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    15-80-0107 0015800107 A-70567-0207

Molex Electronics Ltd.
Part No. 15-80-0107 0015800107 A-70567-0207
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.

File Size 1,218.53K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021121-00018D1LF
Description Minitek127®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 18Positions, 1.27mm (0.5inch) pitch.
Tech specs    

Official Product Page

    15-80-0109 0015800109 70567-0275 A-70567-0275

Molex Electronics Ltd.
Part No. 15-80-0109 0015800109 70567-0275 A-70567-0275
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
Molex Electronics Ltd.

File Size 1,218.56K  /  7 Page

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Amphenol Communications Solutions

Part No. 10018783-11112TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x8, 98 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    70567-0010 A-70567-0010 0015800241

Molex Electronics Ltd.
Part No. 70567-0010 A-70567-0010 0015800241
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, Tin (Sn) Plating

File Size 1,218.42K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021321-10018T4LF
Description SMT TYPE RECEPTACLE
Tech specs    

Official Product Page

    70567-0011 A-70567-0011 0015800261

Molex Electronics Ltd.
Part No. 70567-0011 A-70567-0011 0015800261
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, Tin (Sn) Plating

File Size 1,218.43K  /  7 Page

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Amphenol Communications Solutions

Part No. 10119109-210018LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 10 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0015800381 70567-0017 15-80-0381

Molex Electronics Ltd.
Part No. 0015800381 70567-0017 15-80-0381
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, Tin (Sn) Plating

File Size 1,218.40K  /  7 Page

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Amphenol Communications Solutions

Part No. 10018783-10003TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    0015800289 A-70567-0284

Molex Electronics Ltd.
Part No. 0015800289 A-70567-0284
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
MOLEX Connector

File Size 1,218.56K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021321-10018C4LF
Description SMT TYPE RECEPTACLE
Tech specs    

Official Product Page

    15-80-0125 0015800125 70567-0140

Molex Electronics Ltd.
Part No. 15-80-0125 0015800125 70567-0140
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.76渭m (30渭") Gold (Au) Selective Pla
Molex Electronics Ltd.

File Size 1,218.47K  /  7 Page

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Amphenol Communications Solutions

Part No. 10018783-00101TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x4, 64 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    0015800281 70567-0012 15-80-0281

Molex Electronics Ltd.
Part No. 0015800281 70567-0012 15-80-0281
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
MOLEX Connector

File Size 1,218.43K  /  7 Page

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Amphenol Communications Solutions

Part No. 55510-018LF
Description <span style=\\background-color: #FFFF00\\><b>PREFERRED P/N SERIES FOR NEW PROJECT: 10131937</b></span><br><br>Minitek® 2.00mm, Board to Board Connector, PCB Mounted Receptacle , Vertical , Surface Mount, Double row, 18 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

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