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MAX6860 M27W402 TB0264A CHV34H28 AMS1501 MP801G CD5265B M41256A
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  73943-7000 Datasheet PDF File

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    304-11-114-41-770000

Mill-Max Mfg. Corp.
Part No. 304-11-114-41-770000
Description    Interconnect Socket Solderless Press-Fit Socket
File Size 128.75K  /  3 Page

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Amphenol Communications Solutions
Part No. 70007-001LF
Description Din Accessory Shroud 3x32 Back Side, Metal Inserts
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    304-11-108-41-770000

Mill-Max Mfg. Corp.
Part No. 304-11-108-41-770000
Description    Interconnect Socket Solderless Press-Fit Socket
File Size 128.75K  /  3 Page

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Amphenol Communications Solutions
Part No. 70007-005LF
Description Din Accessory Shroud 3x32 Back Side, Metal Inserts
Tech specs 　 　

Official Product Page

    304-11-106-41-770000

Mill-Max Mfg. Corp.
Part No. 304-11-106-41-770000
Description    Interconnect Socket Solderless Press-Fit Socket
File Size 128.75K  /  3 Page

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Amphenol Communications Solutions
Part No. 70005-001LF
Description Din Accessory Shroud
Tech specs 　 　

Official Product Page

    304-11-107-41-770000

Mill-Max Mfg. Corp.
Part No. 304-11-107-41-770000
Description    Interconnect Socket Solderless Press-Fit Socket
File Size 128.75K  /  3 Page

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Amphenol Communications Solutions
Part No. 68739-434HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 34 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

    SDA-7000 SDA-7000SB

RF Micro Devices
Part No. SDA-7000 SDA-7000SB
Description GaAs Distributed Amplifier
File Size 1,833.41K  /  9 Page

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Amphenol Communications Solutions
Part No. 68739-430HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

    304-11-104-41-770000

Mill-Max Mfg. Corp.
Part No. 304-11-104-41-770000
Description    Interconnect Socket Solderless Press-Fit Socket
File Size 128.75K  /  3 Page

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Amphenol Communications Solutions
Part No. 68739-436HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

    304-11-109-41-770000

Mill-Max Mfg. Corp.
Part No. 304-11-109-41-770000
Description    Interconnect Socket Solderless Press-Fit Socket
File Size 128.98K  /  3 Page

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Amphenol Communications Solutions
Part No. 68739-438HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 38 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

    304-11-103-41-770000

Mill-Max Mfg. Corp.
Part No. 304-11-103-41-770000
Description    Interconnect Socket Solderless Press-Fit Socket
File Size 128.75K  /  3 Page

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Amphenol Communications Solutions
Part No. 68739-432HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 32 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

    304-11-112-41-770000

Mill-Max Mfg. Corp.
Part No. 304-11-112-41-770000
Description    Interconnect Socket Solderless Press-Fit Socket
File Size 128.75K  /  3 Page

View it Online

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Texas Instruments
Part No. BQ27000DRKR
Description Single-Cell Li-Ion and Li-Pol Battery Gas Gauge IC 10-VSON -20 to 70
Tech specs 　 　

Official Product Page

    304-11-111-41-770000

Mill-Max Mfg. Corp.
Part No. 304-11-111-41-770000
Description    Interconnect Socket Solderless Press-Fit Socket
File Size 128.74K  /  3 Page

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Texas Instruments
Part No. 5962-8870001RA
Description Octal D-type Transparent Latches With 3-State Outputs 20-CDIP -55 to 125
Tech specs 　 　

Official Product Page

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