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  74300-8163 Datasheet PDF File

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    FAIR-RITE PRODUCTS CORP
Part No. 2773004111 2743004111
Description 1 FUNCTIONS, FERRITE BEAD
File Size 344.28K  /  12 Page

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Amphenol Communications Solutions
Part No. 47743-000LF
Description PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
Tech specs 　 　

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HUA FENG CIRCUIT





    Samsung Electronic
Part No. K4S281632E-TC7C K4S281632E-TL7C
Description 2M x 16bit x 4 banks synchronous DRAM LVTTL, 133MHz
File Size 59.25K  /  11 Page

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Amphenol Communications Solutions
Part No. 10111743-008LF
Description HPCE R/A REC 52P22S
Tech specs 　 　

Official Product Page

    K4M28163LF K4M28163LF-C K4M28163LF-L K4M28163LF-N K4M28163LF-R1L K4M28163LF-R75 K4M28163LF-RE K4M28163LF-S K4M28163LF-BR

SAMSUNG[Samsung semiconductor]
Samsung Electronic
SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K4M28163LF K4M28163LF-C K4M28163LF-L K4M28163LF-N K4M28163LF-R1L K4M28163LF-R75 K4M28163LF-RE K4M28163LF-S K4M28163LF-BR750
Description 2M x 16Bit x 4 Banks Mobile SDRAM in 54FBGA 200万16 × 4银行4FBGA移动SDRAM
8M X 16 SYNCHRONOUS DRAM, 5.4 ns, PBGA54
File Size 112.71K  /  12 Page

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Amphenol Communications Solutions
Part No. 47743-002LF
Description PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
Tech specs 　 　

Official Product Page

    0039348163 5569-16B1-210

http://
Molex Electronics Ltd.
Part No. 0039348163 5569-16B1-210
Description 4.20mm (.165) Pitch Mini-Fit Jr.?/a> Header, Dual Row, Right Angle, with Flange, 16 Circuits, 66 Nylon 94V-0, Tin Plating
4.20mm (.165) Pitch Mini-Fit Jr. Header, Dual Row, Right Angle, with Flange, 16 Circuits, 66 Nylon 94V-0, Tin Plating
File Size 109.27K  /  3 Page

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Amphenol Communications Solutions
Part No. U10A474300T
Description SlimSAS Right angle X8 15u\\ Gold plating, Latch pin length=1.5mm, 24G, T&R packing
Tech specs 　 　

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    ACCUTEK MICROCIRCUIT CO...
Part No. AK5816384S AK5816384S-09 AK5816384G
Description    Dynamic Random Access Memory
File Size 71.49K  /  2 Page

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Amphenol Communications Solutions
Part No. U10BH7430001T
Description SlimSAS Vertical X8 15u\\ Gold plating, Latch pin inside, Latch pin length=1.5mm, 24G, T&R packing
Tech specs 　 　

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    K4H281638L-LCB3 K4H281638L-LCCC K4H281638L-LCCD

Samsung semiconductor
Part No. K4H281638L-LCB3 K4H281638L-LCCC K4H281638L-LCCD
Description 128Mb L-die DDR SDRAM Specification
File Size 478.42K  /  32 Page

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Amphenol Communications Solutions
Part No. 10111743-009LF
Description HPCE R/A REC 52P22S
Tech specs 　 　

Official Product Page

    D45128163G5

NEC
Part No. D45128163G5
Description Search --To UPD45128163G5
File Size 873.94K  /  92 Page

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Amphenol Communications Solutions
Part No. 77430-001LF
Description Din Accessory Shroud Stand off
Tech specs 　 　

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    GM71C18163C GM71C18163C-5 GM71C18163C-6 GM71C18163C-7

Hynix Semiconductor
Part No. GM71C18163C GM71C18163C-5 GM71C18163C-6 GM71C18163C-7
Description 1,048,576 WORDS x 16 BIT CMOS DYNAMIC RAM
File Size 88.95K  /  11 Page

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Amphenol Communications Solutions
Part No. 70298-163LF
Description 4 Row Signal Header, 48 Position, Straight, Press-Fit, Wide body
Tech specs 　 　

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    K4S281632B-N K4S281632B-NC_L1H K4S281632B-NC_L1L K4S281632B-NC/L1H K4S281632B-NC/L1L K4S281632B-NC1H K4S281632B-NC1L K4S

Samsung Electronic
SAMSUNG[Samsung semiconductor]
SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K4S281632B-N K4S281632B-NC_L1H K4S281632B-NC_L1L K4S281632B-NC/L1H K4S281632B-NC/L1L K4S281632B-NC1H K4S281632B-NC1L K4S281632B-NL1H
Description 128Mb SDRAM, 3.3V, LVTTL, 100MHz
2M x 16Bit x 4 Banks Synchronous DRAM in sTSOP 200万16 × 4银行同步DRAM在sTSOP
File Size 62.82K  /  8 Page

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Amphenol Communications Solutions
Part No. 75844-816-32LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 32 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

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    GM71V18163A

Hynix Semiconductor
Part No. GM71V18163A
Description (GM71VS18163AL / GM71V18163A) 1M x 16-Bit CMOS DRAM
File Size 1,832.19K  /  28 Page

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