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  75757-5161 Datasheet PDF File

For 75757-5161 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

    0757570161 75757-0161

Molex Electronics Ltd.
Part No. 0757570161 75757-0161
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 6 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating Overall
MOLEX Connector

File Size 99.39K  /  3 Page

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Amphenol Communications Solutions

Part No. 51617-XX002LF
Description PwrBlade®, Power Supply Connectors, 5P 24S 1M 7P PF Vertical Receptacle.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0757570162 75757-0162

Molex Electronics Ltd.
Part No. 0757570162 75757-0162
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 6 Circuits, 1.25um (50u) Nickel (Ni) Overall
MOLEX Connector

File Size 99.39K  /  3 Page

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Amphenol Communications Solutions

Part No. 84516-102
Description 200 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array
Tech specs    

Official Product Page

    0757570131 75757-0131

Molex Electronics Ltd.
Part No. 0757570131 75757-0131
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 3 Circuits, 1.25um (50u) Nickel (Ni) Overall
MOLEX Connector

File Size 99.50K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-3516-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    0757571121 75757-1121

Molex Electronics Ltd.
Part No. 0757571121 75757-1121
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length
3.50mm (.138") Pitch, MX150垄芒 Header, Breakaway, Vertical, 4 Circuits, 2.5楼矛m (100楼矛") Tin (Sn) Plating, 11.20mm (.441") Mating Pin Length, 3.05mm (.120") PC Ta

File Size 166.62K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-8516-11D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    0757571101 75757-1101

Molex Electronics Ltd.
Part No. 0757571101 75757-1101
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 20 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 20 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length
3.50mm (.138) Pitch, MX150垄芒 Header, Breakaway, Vertical, 20 Circuits, 2.5楼矛m (100楼矛) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length

File Size 166.58K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-7516-11H
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    0757571342 75757-1342

Molex Electronics Ltd.
Part No. 0757571342 75757-1342
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 8 Circuits, 0.75μm (30μ) Select Gold (Au) Plating, 11.20mm (.441) Mating Pin Length
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 8 Circuits, 0.75μm (30μ) Select Gold (Au) Plating, 11.20mm (.441) Mating Pin Length
MOLEX Connector

File Size 166.66K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-516122300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    75757-0121 0757570121

Molex Electronics Ltd.
Part No. 75757-0121 0757570121
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 2 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating Overall

File Size 98.93K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-7516-11D
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    0757571281

Molex Electronics Ltd.
Part No. 0757571281
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 16 Circuits, Gold (AuFlash Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length

File Size 166.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-6516-11H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    75757-6231 0757576231

Molex Electronics Ltd.
Part No. 75757-6231 0757576231
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 6 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 6 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 166.28K  /  4 Page

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Amphenol Communications Solutions

Part No. F516-1A7H1-21014
Description Flex Connector, 1.00mm Pitch, Height 2.00mm, Right angle, Flip type, ZIF, 14 position, With MYLAR
Tech specs    

Official Product Page

    75757-6241 0757576241

Molex Electronics Ltd.
Part No. 75757-6241 0757576241
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 8 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 166.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 10137925-1612LF
Description Minitek® Pwr 3.0, Dual Row, Right Angle SMT Tails and DIP Hold Down Header, Tin plating, Black Color, 16 Positions, Non GW Compatible LCP, Tape and Reel. .
Tech specs    

Official Product Page

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