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  87758-1450 Datasheet PDF File

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    0877582850

Molex Electronics Ltd.
Part No. 0877582850
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
MOLEX Connector

File Size 135.97K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-114501450LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 50 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87758-5017 0877585017

Molex Electronics Ltd.
Part No. 87758-5017 0877585017
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
   2.00mm (.079) Pitch Milli-Grid?Header, Through Hole, Vertical, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.76K  /  4 Page

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Amphenol Communications Solutions

Part No. 10114508-D0J-20DLF
Description XCede® High Speed Backplane Connectors, Left polarizing guide module with key feature.
Tech specs    

Official Product Page

    87758-5016 0877585016

Molex Electronics Ltd.
Part No. 87758-5016 0877585016
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
   2.00mm (.079) Pitch Milli-Grid?Header, Through Hole, Vertical, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 10114508-00J-20DLF
Description XCede® High Speed Backplane Connectors, 2 wall header.
Tech specs    

Official Product Page

    87758-4017 0877584017

Molex Electronics Ltd.
Part No. 87758-4017 0877584017
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.76K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-409061450LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 6 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    87758-3217 0877583217

Molex Electronics Ltd.
Part No. 87758-3217 0877583217
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 10114508-00J-30DLF
Description XCede® High Speed Backplane Connectors, 2 wall header.
Tech specs    

Official Product Page

    0877582816

Molex Electronics Ltd.
Part No. 0877582816
Description MOLEX Connector

File Size 170.91K  /  4 Page

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Amphenol Communications Solutions

Part No. 10114508-B0J-10DLF
Description XCede® High Speed Backplane Connectors, Left polarizing guide module with key feature.
Tech specs    

Official Product Page

    0877582817

Molex Electronics Ltd.
Part No. 0877582817
Description MOLEX Connector

File Size 170.90K  /  4 Page

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Amphenol Communications Solutions

Part No. 10114508-D0J-40DLF
Description XCede® High Speed Backplane Connectors, Left polarizing guide module with key feature.
Tech specs    

Official Product Page

    0877584817 87758-4817

Molex Electronics Ltd.
Part No. 0877584817 87758-4817
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 48 Circuits
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 48 Circuits

File Size 170.70K  /  4 Page

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Amphenol Communications Solutions

Part No. 10114508-G0J-30DLF
Description XCede® High Speed Backplane Connectors, Left polarizing guide module with key feature.
Tech specs    

Official Product Page

    0877580416 87758-0416

Molex Electronics Ltd.
Part No. 0877580416 87758-0416
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 10114508-L0J-10DLF
Description XCede® High Speed Backplane Connectors, 3 wall left header.
Tech specs    

Official Product Page

    0877580417 87758-0417

Molex Electronics Ltd.
Part No. 0877580417 87758-0417
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.76K  /  4 Page

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Amphenol Communications Solutions

Part No. 10114508-P0J-30DLF
Description XCede® High Speed Backplane Connectors, Right polarized guide header module with key.
Tech specs    

Official Product Page

For 87758-1450 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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