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  90130-3350 Datasheet PDF File

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    0901301132 90130-1132

Molex Electronics Ltd.
Part No. 0901301132 90130-1132
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 32 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)
File Size 585.90K  /  7 Page

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Texas Instruments
Part No. REG104FA-3.3/500
Description 1A, Low-Noise, Low Dropout Regulator 5-DDPAK/TO-263
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    0039013085 0039013085-18

Molex Electronics Ltd.
Part No. 0039013085 0039013085-18
Description Mini-Fit Jr. Receptacle Housing, Dual Row, 8 Circuits, UL 94V-2, Black
File Size 22.95K  /  1 Page

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Texas Instruments
Part No. REG1117F-3.3/500
Description 1A Low Dropout Positive Regulator 3-DDPAK/TO-263 0 to 125
Tech specs 　 　

Official Product Page

    0901301118 90130-1118

Molex Electronics Ltd.
Part No. 0901301118 90130-1118
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded 18 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)
File Size 585.88K  /  7 Page

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Texas Instruments
Part No. TPS43350QDAPRQ1
Description 40V Dual Synchronous Buck Controller 38-HTSSOP -40 to 125
Tech specs 　 　

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Official Product Page

    0901301116 90130-1116

Molex Electronics Ltd.
Part No. 0901301116 90130-1116
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 16 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)
File Size 585.88K  /  7 Page

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Amphenol Communications Solutions
Part No. 68690-130HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

    0901301114 90130-1114

Molex Electronics Ltd.
Part No. 0901301114 90130-1114
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 14 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)
File Size 585.88K  /  7 Page

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Amphenol Communications Solutions
Part No. 92090-130LF
Description Minitek® 2.00mm, Board to Board, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, Top Entry, 30 Positions, 2.00mm (0.079in) Pitch..
Tech specs 　 　

Official Product Page

    0901301112 90130-1112

Molex Electronics Ltd.
Part No. 0901301112 90130-1112
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 12 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)
File Size 585.88K  /  7 Page

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Amphenol Communications Solutions
Part No. 10065490-130TRLF
Description Minitek® 2.00mm, Board To Board, Receptacle, Vertical, Surface Mount, Double Row, 30 Positions, 2.00mm (0.079in) Pitch.
Tech specs 　 　

Official Product Page

    0901301110 90130-1110

Molex Electronics Ltd.
Part No. 0901301110 90130-1110
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 10 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)
File Size 585.90K  /  7 Page

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Amphenol Communications Solutions
Part No. 78290-130HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs 　 　

Official Product Page

    0901301108 90130-1108

Molex Electronics Ltd.
Part No. 0901301108 90130-1108
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 8 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)
File Size 585.90K  /  7 Page

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Amphenol Communications Solutions
Part No. L17H2990130
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 26/26 (Socket/Socket), Flash Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 4*Arrowhead Boardlock
Tech specs 　 　

Official Product Page

    0901303112

Molex Electronics Ltd.
Part No. 0901303112
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 12 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)
File Size 168.44K  /  4 Page

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Amphenol Communications Solutions
Part No. 69190-130HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    0510901300 51090-1300

Molex Electronics Ltd.
Part No. 0510901300 51090-1300
Description 2.00mm (.079) Pitch Mi II?/a> System Wire-to-Board Crimp Housing, Single Row, 13Circuits
2.00mm (.079) Pitch Mi II System Wire-to-Board Crimp Housing, Single Row, 13Circuits
File Size 87.21K  /  2 Page

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