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  90663-3161 Datasheet PDF File

For 90663-3161 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

    90663-1149 0906631149

Molex Electronics Ltd.
Part No. 90663-1149 0906631149
Description 2.54mm (.100) Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 14 Circuits
2.54mm (.100") Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 14 Circuits

File Size 184.25K  /  4 Page

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Amphenol Communications Solutions

Part No. 77316-148LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single row , Polarized, 3 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    MOLEX INC
Part No. 0906633341
Description 34 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER

File Size 29.46K  /  2 Page

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Amphenol Communications Solutions

Part No. 61083-161606LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

    0906631641 90663-1641

Molex Electronics Ltd.
Part No. 0906631641 90663-1641
Description 2.54mm (.100) Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 64 Circuits
2.54mm (.100") Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 64 Circuits

File Size 184.48K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-5316-11D
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, 6 Column, Left End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    0906631202 90663-1202

Molex Electronics Ltd.
Part No. 0906631202 90663-1202
Description 2.54mm (.100") Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 20 Circuits
2.54mm (.100) Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 20 Circuits

File Size 184.37K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4316-11H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Left End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    0906631201 90663-1201

Molex Electronics Ltd.
Part No. 0906631201 90663-1201
Description 2.54mm (.100") Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 20 Circuits
2.54mm (.100) Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 20 Circuits

File Size 184.37K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-6116-11H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    intel
Part No. P28F010 28F010 29066301
Description IC,EEPROM,FLASH,128KX8,CMOS,DIP,32PIN,PLASTIC
5 Volt Bulk Erase Flash Memory
From old datasheet system

File Size 737.30K  /  47 Page

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Amphenol Communications Solutions

Part No. 77316-140LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single row , Polarized, 36 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    90663-1142 0906631142

Molex Electronics Ltd.
Part No. 90663-1142 0906631142
Description 2.54mm (.100) Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 14 Circuits
2.54mm (.100") Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 14 Circuits

File Size 184.53K  /  4 Page

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Amphenol Communications Solutions

Part No. 61083-161400LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

    Motorola, Inc.
Part No. MC33161P MC33161D
Description 24 mm Circular Inlay R/O 0-RFIDN 0 to 0
Tag-it(TM) HF-I Standard Transponder Inlays CD 0-RFIDN

File Size 296.75K  /  16 Page

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Amphenol Communications Solutions

Part No. G8231612YCPEU
Description Board mount - Header Plug - Box Header 2.0mm Pitch Vertical,2x8Pin,15u\\ Gold,NY4T,TAIL=2.1mm,With one Post
Tech specs    

Official Product Page

    TMT
Part No. T431616D T431616E
Description (T431616D/E) 1M x 16 SDRAM 512K x 16bit x 2Banks Synchronous DRAM

File Size 778.68K  /  74 Page

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Amphenol Communications Solutions

Part No. 54122-403161000LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    2SK3161S 2SK3161L 2SK3161

HITACHI[Hitachi Semiconductor]
Part No. 2SK3161S 2SK3161L 2SK3161
Description Silicon N Channel MOS FET High Speed Power Switching

File Size 54.06K  /  9 Page

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Amphenol Communications Solutions

Part No. 131-6114-21H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

For 90663-3161 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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