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  99-3300 Datasheet PDF File

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    2SK33007 2SK330

Toshiba Semiconductor
Part No. 2SK33007 2SK330
Description Silicon N Channel Junction Type For Audio Amplifier, Analog Switch, Constant Current and Impedance Converter Applications
File Size 651.27K  /  5 Page

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Amphenol Communications Solutions
Part No. 51733-009LF
Description PwrBlade®, Power Supply Connectors, 5P Right Angle Header.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    PANASONIC[Panasonic Semiconductor]
Part No. MSG33002
Description SIGE HBT TYPE FOR LOW-NOISE RF AMPLIFIER
File Size 84.75K  /  4 Page

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Amphenol Communications Solutions
Part No. U77F1313300T
Description ExpressPort SFP+, High Speed Input Output Connectors, SFP PLUS CAGE SOLDER 3.2MM.
Tech specs 　 　

Official Product Page

    DDP3300A

Micronas
Part No. DDP3300A
Description Single-Chip Display and Deflection Processor
File Size 1,954.12K  /  53 Page

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Amphenol Communications Solutions
Part No. 73983-3001LF
Description Metral®, Backplane connectors, 1000 Series Header, Vertical Signal, 5 Row, Press-Fit, 30 Position, Special Load, Standard
Tech specs 　 　

Official Product Page

    AN13300A

Panasonic Semiconductor
Part No. AN13300A
Description    Silicon Monolithic Bipolar IC
For Information·Communication - For MPEG2
File Size 161.05K  /  6 Page

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Amphenol Communications Solutions
Part No. 73983-3004LF
Description Metral®, Backplane connectors, 1000 Series Header, Vertical Signal, 5 Row, Press-Fit, 30 Position, Special Load, Standard
Tech specs 　 　

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    Micronas Semiconductor Holding AG
Part No. DDP3300A
Description Single-Chip Display and Deflection Processor 单芯片显示器和偏转处理器
File Size 1,768.13K  /  53 Page

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Amphenol Communications Solutions
Part No. 10119109-330018LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

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    TY Semiconductor Co., Ltd
Part No. DMN3300U-7-F
Description Product specification
File Size 204.71K  /  1 Page

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Amphenol Communications Solutions
Part No. 75970-330-03LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row,3 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

   
Part No. STMP3300
Description STMP3300 : Value-Line Audio Decoder with USB Interface Product Brief (pdf. 465Kb. 5-3300-P1-1.0-0701)
File Size 462.45K  /  3 Page

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Amphenol Communications Solutions
Part No. 101269330040204ELF
Description HPCE-STRADDLE MOUNT ASSEMBLY 40P20S
Tech specs 　 　

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    TY Semiconductor Co., Ltd
Part No. DMN3300U-7
Description Ultra Low Gate Threshold Voltage
File Size 71.40K  /  1 Page

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Amphenol Communications Solutions
Part No. 48233-000LF
Description PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
Tech specs 　 　

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    http://
Part No. MSG33002
Description SIGE HBT TYPE FOR LOW-NOISE RF AMPLIFIER
File Size 90.90K  /  4 Page

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Amphenol Communications Solutions
Part No. 55733-001
Description GIG-Array®, Mezzanine Connectors, 15mm Receptacle 296 Position.
Tech specs 　 　

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    ZCOMM[Z-Communications, Inc]
Part No. SMV3300A
Description LOW COST - HIGH PERFORMANCE VOLTAGE CONTROLLED OSCILLATOR
File Size 131.79K  /  2 Page

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Amphenol Communications Solutions
Part No. U77A11133001
Description 1X1 SFP CAGE 3.2 S/P
Tech specs 　 　

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