CGA-6618 pdf Datasheet P13 Part Num --- IC-ON-LINE


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CGA-6618 Datasheet PDF File

For CGA-6618 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |

					TDK Electronics
Part No.	CGA3E2C0G1H121J080AA-17
Description	Multilayer Ceramic Chip Capacitors
File Size	174.27K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	131-6618-21H
Description	Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right Polarized, Backplane Module, 2.25mm Wipe, APP.
Tech specs				Official Product Page

HUA FENG CIRCUIT

					TDK Electronics
Part No.	CGA4J3X7R1C475M125AE
Description	Multilayer Ceramic Chip Capacitors
File Size	130.65K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	131-6618-21D
Description	Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right Polarized, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs				Official Product Page

					TDK Electronics
Part No.	CGA3E2C0G1H122J080AE
Description	Multilayer Ceramic Chip Capacitors
File Size	162.33K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10156618-0200LF
Description	Minitek® Board-In, Wire to Board Connectors, Vertical housing 2.50mm 2 positions
Tech specs				Official Product Page

					TDK Electronics
Part No.	CGA3E2C0G1H122J080AA-17
Description	Multilayer Ceramic Chip Capacitors
File Size	177.99K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10156618-1200LF
Description	Minitek® Board-In, Wire to Board Connectors, Vertical housing 2.50mm 12 positions
Tech specs				Official Product Page

					TDK Electronics
Part No.	CGA3E2C0G1H120J080AA-17
Description	Multilayer Ceramic Chip Capacitors
File Size	174.48K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10156618-1100LF
Description	Minitek® Board-In, Wire to Board Connectors, Vertical housing 2.50mm 11 positions
Tech specs				Official Product Page

					TDK Electronics
Part No.	CGA3E2C0G1H102J080AE
Description	Multilayer Ceramic Chip Capacitors
File Size	160.33K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10156618-0400LF
Description	Minitek® Board-In, Wire to Board Connectors, Vertical housing 2.50mm 4 positions
Tech specs				Official Product Page

					TDK Electronics
Part No.	CGA3E2C0G1H102J080AA-17
Description	Multilayer Ceramic Chip Capacitors
File Size	179.06K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10156618-1400LF
Description	Minitek® Board-In, Wire to Board Connectors, Vertical housing 2.50mm 14 positions
Tech specs				Official Product Page

					TDK Electronics
Part No.	CGA3E2C0G1H101J080AE
Description	Multilayer Ceramic Chip Capacitors
File Size	162.61K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	DWRT200PM16618
Description	COOLPOWER MEZZANINE
Tech specs				Official Product Page

					TDK Electronics
Part No.	CGA3E2C0G1H100D080AA-17
Description	Multilayer Ceramic Chip Capacitors
File Size	172.39K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	131-6618-11H
Description	Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs				Official Product Page

					TDK Electronics
Part No.	CGA3E2C0G1H151J080AA-17
Description	Multilayer Ceramic Chip Capacitors
File Size	171.85K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	131-6618-11D
Description	Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs				Official Product Page

For CGA-6618 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |

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