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Renesas Electronics Corporation |
| Part No. |
DA14681-01000U2
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| Description |
SmartBond™ Bluetooth® Low Energy 4.2 System-on-Chip (SoC)
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| Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
| Part No. |
DA14681-01000U22
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| Description |
SmartBond™ Bluetooth® Low Energy 4.2 System-on-Chip (SoC)
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| Tech specs |
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Official Product Page
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Data Delay Devices Inc
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| Part No. |
DDU8CSERIES DDU8C-5050A1 DDU8C-5050B1 DDU8C-5050M DDU8C-5050MD1 DDU8C-5050MD4 DDU8C-5060 DDU8C-5060A1 DDU8C-5060MD1 DDU8C-5060MD4 DDU8C-5075 DDU8C-5075A1 DDU8C-5075M DDU8C-5075B1 DDU8C-5100M DDU8C-5100B1 DDU8C-5100MD1 DDU8C-5125B1 DDU8C-5125M DDU8C-5125MD4 DDU8C-5125MD1 DDU8C-5125A1 DDU8C-5100A1 DDU8C-5075MD4 DDU8C-5075MD1 DDU8C-5060B1
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| Description |
5-TAP, HCMOS-INTERFACED FIXED DELAY LINE
Total delay 50 /-2.5 ns, 5-TAP, HCMOS-interfaced fixed delay line
Total delay 60 /-3 ns, 5-TAP, HCMOS-interfaced fixed delay line
Total delay 75 /-4 ns, 5-TAP, HCMOS-interfaced fixed delay line
Total delay 100 /-5 ns, 5-TAP, HCMOS-interfaced fixed delay line
Total delay 125 /-6.5 ns, 5-TAP, HCMOS-interfaced fixed delay line
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| File Size |
47.22K /
4 Page |
 View
it Online |
Download Datasheet
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Renesas Electronics Corporation |
| Part No. |
DA14681-01000A92
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| Description |
SmartBond™ Bluetooth® Low Energy 4.2 System-on-Chip (SoC)
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54112-809101000LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
G8250101000YEU
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| Description |
Board mount - Header Receptacle - Pin Header 2.0mm Pitch Vertical DIP,1x10Pin,Gold flash,LCP,4.0mm*2.0mm*2.8mm,Color-Black,BAG
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54242-507101000LF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Stacking Header, Surface Mount, Double row, 10 Positions, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10126010-10002TLF
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| Description |
PCI Express® GEN 3 Card Edge, Storage and Server Connector, Straddle-Mount, x8, 98 Positions, 1.00mm (0.039in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54112-807101000LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54242-103101000LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
CE1010000110111
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| Description |
Cool Edge 0.80mm Hybrid Power and Signal Connectors, Storage and Server System, Surface mount, 100 signal pins, Vertical
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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