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  die-46 Datasheet PDF File

For die-46 Found Datasheets File :: 9152    Search Time::0.89ms    
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    K4S560832E-NCL75 K4S561632E-NCL60 K4S561632E-NCL75 K4S560432E-NC K4S560432E-NCL75 K4S561632E-NC75

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4S560832E-NCL75 K4S561632E-NCL60 K4S561632E-NCL75 K4S560432E-NC K4S560432E-NCL75 K4S561632E-NC75
OCR Text die (x4, x8, x16) CMOS SDRAM 256Mb E-die SDRAM Specification 54pin sTSOP-II Revision 1.0 August. 2003 * Samsung Electronics rese...46 x16 VSS DQ15 VSSQ DQ14 DQ13 VDDQ DQ12 DQ11 VSSQ DQ10 DQ9 VDDQ DQ8 VSS NC UDQM CLK CKE A12 A11...
Description 16M x 16 SDRAM, LVTTL, 133MHz
256Mb E-die SDRAM Specification 54pin sTSOP-II

File Size 205.22K  /  14 Page

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    K4S560832E-TC75 K4S560832E-TL75 K4S561632E K4S561632E-TC60 K4S561632E-TC75 K4S561632E-TL60 K4S561632E-TL75 K4S560432E-TL

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4S560832E-TC75 K4S560832E-TL75 K4S561632E K4S561632E-TC60 K4S561632E-TC75 K4S561632E-TL60 K4S561632E-TL75 K4S560432E-TL75 K4S560432E-TC75 K4S560432E-TC
OCR Text die (x4, x8, x16) CMOS SDRAM 256Mb E-die SDRAM Specification Revision 1.3 September. 2003 * Samsung Electronics reserves the rig...46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 CMOS SDRAM x4 VSS N.C VSSQ N.C DQ3 V...
Description 256Mb E-die SDRAM Specification 54pin sTSOP-II

File Size 196.59K  /  14 Page

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    MBRB4030 MBRB4030_D

ON Semi
MOTOROLA[Motorola, Inc]
Part No. MBRB4030 MBRB4030_D
OCR Text ...for Stress Protection * Maximum Die Size * 150C Operating Junction Temperature * Short Heat Sink Tab Manufactured - Not Sheared Mechanical C...46 0.34 0.55 0.45 IR 0.35 150 V mA (c)RectifierInc. 1996 Data Motorola, Device 1 MBRB...
Description SWITCHMODE?/a> Power Rectifier
SWITCHMODE Power Rectifier
40 AMPERES 30 VOLTS
SWITCHMODE⑩ Power Rectifier

File Size 69.73K  /  4 Page

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    MCR718 MCR718T4 MCR716T4 MCR716

ONSEMI[ON Semiconductor]
Part No. MCR718 MCR718T4 MCR716T4 MCR716
OCR Text ... * * * Small Size Passivated Die for Reliability and Uniformity Low Level Triggering and Holding Characteristics Surface Mount Lead Form ...46 0.58 0.94 1.14 4.58 BSC 0.87 1.01 0.46 0.58 2.60 2.89 2.29 BSC 4.57 5.45 0.63 1.01 0.51 --- 0.89 ...
Description Silicon Controlled Rectifier (Reverse Blocking Thyristors)
Sensitive Gate Silicon Controlled Rectifiers(SCRs 4.0 AMPERES RMS 400 − 600 VOLTS)
Sensitive Gate Silicon Controlled Rectifiers(SCRs 4.0 AMPERES RMS 400 - 600 VOLTS)

File Size 68.12K  /  6 Page

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    MGS-70008

Agilent (Hewlett-Packard)
HP[Agilent(Hewlett-Packard)]
Part No. MGS-70008
OCR Text ...r more application details. The die is fabricated using HP's nominal 0.7 m Schottky-barriergate, gold metallization, and silicon nitride pas...46 S11 Ang. -6.2 0.3 7.6 13.6 14.7 14.5 14.0 10.2 8.1 1.4 -3.2 -8.5 -13.1 -14.1 7.4 141.4 143.2 129....
Description Reflective SPDT GaAs MMIC Switch(反射型单刀双掷砷化镓单片式微波集成电路开

File Size 46.82K  /  5 Page

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    MTD5P06E

MOTOROLA INC
Motorola, Inc.
MOTOROLA[Motorola, Inc]
Part No. MTD5P06E
OCR Text ... 0.25 from package to center of die) Internal Source Inductance (Measured from the source lead 0.25 from package to source bond pad) (1) Pul...46 TJ = 25C 0.42 VGS = 10 V 0.38 0.52 0.44 25C 0.36 - 55C 0.28 0.34 15 V 0.30 0.20 ...
Description TMOS POWER FET 5.0 AMPERES 60 VOLTS RDS(on) = 0.55 OHM

File Size 207.75K  /  10 Page

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    PHD12NQ15T PHP12NQ15T PHB12NQ15T PHB12NQ15T/T3

http://
PHILIPS[Philips Semiconductors]
NXP Semiconductors N.V.
Part No. PHD12NQ15T PHP12NQ15T PHB12NQ15T PHB12NQ15T/T3
OCR Text ... load Measured tab to centre of die Measured from drain lead to centre of die (SOT78 package only) Measured from source lead to source bond ...46 D max. 11 D1 1.60 1.20 E 10.30 9.70 e 2.54 Lp 2.90 2.10 HD 15.40 14.80 Q 2.60 2.20 OUTLINE VER...
Description N-channel TrenchMOS transistor 12.5 A, 150 V, 0.2 ohm, N-CHANNEL, Si, POWER, MOSFET

File Size 110.51K  /  12 Page

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    TZA3015HW

PHILIPS[Philips Semiconductors]
Part No. TZA3015HW
OCR Text ...s; body 14 x 14 x 1 mm; exposed die pad VERSION SOT638-1 2003 Dec 16 3 Philips Semiconductors Preliminary specification 30 Mb...46 47 43 TZA3015HW RREF LOS SCL(DR2) SDA(DR1) CS(DR0) UI 14 21 24 23 22 13 25 VDD I2C-BU...
Description 30 Mbit/s to 3.2 Gbit/s A-rate 4-bit fibre optic transceiver

File Size 317.22K  /  67 Page

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    W24258S-70LE W24258S-70LI W24258-70LE W24258-70LI W24258Q-70LE W24258Q-70LI W24258 W24258H

Winbond Electronics, Corp.
WINBOND[Winbond]
Part No. W24258S-70LE W24258S-70LI W24258-70LE W24258-70LI W24258Q-70LE W24258Q-70LI W24258 W24258H
OCR Text ... 85 -40 to 85 -40 to 85 PACKAGE Die form 600 mil DIP 330 mil SOP Standard type one TSOP 600 mil DIP 330 mil SOP Standard type one TSOP No...46 1.52 0.25 37.08 14.99 13.72 2.29 3.05 0 16.00 16.51 15.24 13.84 2.54 3.30 4.06 0.56 1.63 0.36 37....
Description 32K X 8 CMOS STATIC RAM 32K X 8 STANDARD SRAM, 100 ns, PDSO28
From old datasheet system
32K ′ 8 CMOS STATIC RAM

File Size 200.65K  /  11 Page

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    ZL10312 ZL10312QCF ZL10312QCG ZL10312QCG1 ZL10312UBH

ZARLINK[Zarlink Semiconductor Inc]
Part No. ZL10312 ZL10312QCF ZL10312QCG ZL10312QCG1 ZL10312UBH
OCR Text ...n LQFP 64 Pin LQFP 64 Pin LQFP* Die supplied in Trays, Bake & Drypack Tape & Reel Trays, Bake & Drypack wafer form** *Pb Free Matte Tin ...46 47 48 Name Gnd CVdd Addr[1] Addr[2] Addr[3] Addr[4] Vdd Gnd AGC Test IRQ CVdd Gnd MOSTRT MOVAL MD...
Description Satellite Demodulator

File Size 232.16K  /  15 Page

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For die-46 Found Datasheets File :: 9152    Search Time::0.89ms    
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