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  HEDT-9140 Datasheet PDF File

For HEDT-9140 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

    0878691401 87869-1401

Molex Electronics Ltd.
Part No. 0878691401 87869-1401
Description 1.60mm (.063) Pitch Board-to-Board Panel Detachable, PCB Header, Surface Mount, 14 Circuits, Gold (Au) Plating, Lublitation, Emboss TapedPackaging, Lead-free

File Size 229.31K  /  4 Page

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Amphenol Communications Solutions

Part No. 10129382-914003BLF
Description EconoStik™ 2.54mm, Board to Board Connector, Unshrouded Header, Double Row, Right-Angle, Through Hole, 14 Positions, 2.54mm Pitch, 8.08mm (0.318inch) Mating, 3.05mm (0.12inch) Tail
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0873691400 87369-1400

Molex Electronics Ltd.
Part No. 0873691400 87369-1400
Description 2.00mm (.079) Pitch Crimp Housing, Single Row, 14 Circuits

File Size 89.56K  /  2 Page

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Amphenol Communications Solutions

Part No. 88914-016LF
Description Metral® Accessories, Backplane Connectors, Board-to-Board Keying System Keying Pin, LF.
Tech specs    

Official Product Page

    0447691403 44769-1403

Molex Electronics Ltd.
Part No. 0447691403 44769-1403
Description 3.00mm (.118) Pitch Micro-Fit 3.0, BMI?/a> Receptacle Header, Dual Row, Vertical, with Press-fit Plastic Pegs, 0.8μm (30μ) Gold (Au) Selective, 14 Circuits
3.00mm (.118") Pitch Micro-Fit 3.0, BMI垄芒 Receptacle Header, Dual Row, Vertical, with Press-fit Plastic Pegs, 0.8楼矛m (30楼矛") Gold (Au) Selective, 14 Circuits

File Size 141.75K  /  3 Page

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Amphenol Communications Solutions

Part No. 69191-405HLF
Description BergStik®, Board to Board connector, Unshrouded right angled header, Through Hole, Single Row, 5 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0447691402 44769-1402

Molex Electronics Ltd.
Part No. 0447691402 44769-1402
Description 3.00mm (.118) Pitch Micro-Fit 3.0, BMI?/a> Receptacle Header, Dual Row, Vertical, with Press-fit Plastic Pegs, 0.38μm (15μ) Gold (Au) Selective, 14 Circuits
3.00mm (.118") Pitch Micro-Fit 3.0, BMI垄芒 Receptacle Header, Dual Row, Vertical, with Press-fit Plastic Pegs, 0.38楼矛m (15楼矛") Gold (Au) Selective, 14 Circuits

File Size 141.75K  /  3 Page

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Amphenol Communications Solutions

Part No. 89891-408LF
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Dual Entry , 16 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    0447691401 44769-1401

Molex Electronics Ltd.
Part No. 0447691401 44769-1401
Description 3.00mm (.118) Pitch Micro-Fit 3.0, BMI Receptacle Header, Dual Row, Vertical, with Press-fit Plastic Pegs
3.00mm (.118") Pitch Micro-Fit 3.0, BMI Receptacle Header, Dual Row, Vertical, with Press-fit Plastic Pegs

File Size 141.74K  /  3 Page

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Amphenol Communications Solutions

Part No. 68691-408H
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 8 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    503159-1400 SD-503159-001 5031591400

Molex Electronics Ltd.
Part No. 503159-1400 SD-503159-001 5031591400
Description 1.50mm (.059") Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Single Row,Through Hole
1.50mm (.059) Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Single Row,Through Hole

File Size 221.19K  /  3 Page

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Amphenol Communications Solutions

Part No. 89891-403H
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Dual Entry , 6 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    SD-44914-001 44914-0401 0449140401

Molex Electronics Ltd.
Part No. SD-44914-001 44914-0401 0449140401
Description 3.00mm (.118") Pitch Micro-Fit 3.0 CPI Header, Compliant Pin Interface, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating
3.00mm (.118) Pitch Micro-Fit 3.0 CPI Header, Compliant Pin Interface, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating

File Size 172.89K  /  3 Page

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Amphenol Communications Solutions

Part No. 10129382-914004BLF
Description EconoStik™ 2.54mm, Board to Board Connector, Unshrouded Header, Double Row, Right-Angle, Through Hole, 14 Positions, 2.54mm Pitch, 8.08mm (0.318inch) Mating, 2.29mm (0.09inch) Tail
Tech specs    

Official Product Page

   
Part No. 2N7236 IRFM9140D
Description 30V N-Channel PowerTrench MOSFET
TRANSISTOR | MOSFET | P-CHANNEL | 100V V(BR)DSS | 18A I(D) | TO-254VAR

File Size 465.07K  /  8 Page

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Amphenol Communications Solutions

Part No. 10129383-914002ALF
Description EconoStik™, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 14 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    HERLEY NEW YORK
Part No. H9140HT49 H9140H41
Description 1000 MHz - 18000 MHz RF/MICROWAVE SGL POLE FOUR THROW SWITCH, 3.3 dB INSERTION LOSS
1000 MHz - 18000 MHz RF/MICROWAVE SGL POLE FOUR THROW SWITCH, 2.8 dB INSERTION LOSS

File Size 59.45K  /  1 Page

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Amphenol Communications Solutions

Part No. 68491-402HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 2 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

   
Part No. 5962-9091401M2X
Description Voltage Reference 电压基准

File Size 467.24K  /  12 Page

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Amphenol Communications Solutions

Part No. 68691-406HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 6 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

For HEDT-9140 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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