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  LTE-3276 Datasheet PDF File

For LTE-3276 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

    HI3276JCQ HI3276

Intersil, Corp.
Intersil Corporation
Part No. HI3276JCQ HI3276
Description Small glass bead with axial leads 2-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, PQFP48
8-Bit, 160MSPS, Flash A/D Converter

File Size 226.60K  /  16 Page

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Texas Instruments

Part No. LM3209TLX/NOPB
Description LM3209 Seamless-Transition Buck-Boost Converter for LTE and HSUPA 12-DSBGA
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    ABS06-107-32768KHZ-T

Abracon Corporation
Part No. ABS06-107-32768KHZ-T
Description 0.6mm max. height ideal for high density circuit boards

File Size 765.89K  /  5 Page

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Texas Instruments

Part No. LM3209TLE/NOPB
Description LM3209 Seamless-Transition Buck-Boost Converter for LTE and HSUPA 12-DSBGA
Tech specs    

Get Free Sample

Official Product Page

   
Part No. LTL23276A
Description Optoelectronic

File Size 475.42K  /  5 Page

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Texas Instruments

Part No. LM3269TLX/NOPB
Description Seamless Transition Buck/Boost Converter for LTE and HSPA RF Power Amplifiers 12-DSBGA -30 to 85
Tech specs    

Official Product Page

    Advanced Semiconductor ...
Part No. ALE3276T2 ALE3276T2-17
Description Internally Matched LNA Module

File Size 207.59K  /  3 Page

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Texas Instruments

Part No. LM3269TLE/NOPB
Description Seamless Transition Buck/Boost Converter for LTE and HSPA RF Power Amplifiers 12-DSBGA -30 to 85
Tech specs    

Get Free Sample

Official Product Page

    ALE3276T2

Advanced Semiconductor Business Inc.
Part No. ALE3276T2
Description Internally Matched LNA Module

File Size 346.41K  /  3 Page

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Amphenol Communications Solutions

Part No. 86094327614H55ELF
Description DIN Straight Header Solder-to-Board Style R/2 32 ways, Class II, with Harpoon
Tech specs    

Official Product Page

    LITE-ON ELECTRONICS INC
光宝科技股份有限公司
LITEON[Lite-On Technology Corporation]
Part No. LTE-3371TL LTE-3271T LTE-3271TL LTE-3371T
Description GaAlAs T-1 3/4 Standard 5 Infrared Emitting Diode

File Size 264.28K  /  3 Page

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Amphenol Communications Solutions

Part No. 86094327614785ELF
Description DIN Straight Header Solder-to-Board Style R 32 ways, MIL Class
Tech specs    

Official Product Page

    Q0.032768-MMTF32-12.5-10 Q0.032768-MMTF32-12.5-20 Q0.032768-SM26FB-12.5-10 Q0.032768-SM26FB-12.5-20

Jauch Quartz Gmbh
Part No. Q0.032768-MMTF32-12.5-10 Q0.032768-MMTF32-12.5-20 Q0.032768-SM26FB-12.5-10 Q0.032768-SM26FB-12.5-20
Description Quartz Crystal

File Size 78.96K  /  1 Page

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Amphenol Communications Solutions

Part No. 86092327624765E1LF
Description DIN Straight Header Solder-to-Board Style R 32 ways, Class I
Tech specs    

Official Product Page

    LTE-1650 LTE-1650BINC

Lite-On Technology Corporation
LITE-ON ELECTRONICS INC
Part No. LTE-1650 LTE-1650BINC
Description Property of Lite-On Only
3 mm, 1 ELEMENT, INFRARED LED, 940 nm

File Size 74.98K  /  3 Page

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Amphenol Communications Solutions

Part No. 86094327614755ELF
Description Din Headers and Receptacles, Backplane connectors, Straight Header Solder-to-Board Style R/2 32 ways, Class II, Tail Length: 4mm
Tech specs    

Official Product Page

    LTE-4208C LTE4208C

Lite-On Technology Corporation
Part No. LTE-4208C LTE4208C
Description GaAs T-1 3/4 Standard Infrared Emitting Diode

File Size 110.90K  /  3 Page

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Amphenol Communications Solutions

Part No. 86094327614745ELF
Description DIN Straight Header Solder-to-Board Style R/2 32 ways, Class III
Tech specs    

Official Product Page

    Lite-On Technology, Corp.
Part No. LTE4208C
Description Optoelectronic 光电

File Size 387.27K  /  6 Page

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Amphenol Communications Solutions

Part No. 65823-276LF
Description Quickie Header, Wire to Board Connector, Double Row, 34 Positions, 2.54 mm (0.1 in.), Right Angle, Eject Latch Header 15u\\/0.38um Au/GXT Plating.
Tech specs    

Official Product Page

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