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Hi-Sincerity Mocroelectronics Corp.
HSMC[Hi-Sincerity Mocroelectronics]
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| Part No. |
H01N60S H01N60SJ H01N60SI
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| OCR Text |
...b40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
DIM A C...Green label is used for pb-free packing Pin Style: 1.Gate 2.Drain 3.Source Material: * Lead solder p... |
| Description |
N-Channel Power Field Effect Transistor
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| File Size |
58.77K /
5 Page |
 View
it Online |
Download Datasheet
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HSMC CORP.
HSMC[Hi-Sincerity Mocroelectronics]
Hi-Sincerity Mocroelectronics Corp.
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| Part No. |
H01N60 H01N60J H01N60I
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| OCR Text |
...b40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
DIM A C...Green label is used for pb-free packing Pin Style: 1.Gate 2.Drain 3.Source Material: * Lead solder p... |
| Description |
N-Channel Power Field Effect Transistor
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| File Size |
58.72K /
5 Page |
View
it Online |
Download Datasheet |
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Hi-Sincerity Mocroelect...
HSMC[Hi-Sincerity Mocroelectronics]
Hi-Sincerity Mocroelectronics Corp.
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| Part No. |
H03N60 H03N60F H03N60E
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| OCR Text |
...b40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
DIM A B...Green label is used for pb-free packing Pin Style: 1.Gate 2.Drain 3.Source Material: * Lead solder p... |
| Description |
N-Channel Power Field Effect Transistor
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| File Size |
55.68K /
5 Page |
View
it Online |
Download Datasheet |
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Hi-Sincerity Mocroelectronics Corp.
HSMC[Hi-Sincerity Mocroelectronics]
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| Part No. |
H04N60F H04N60E H04N60
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| OCR Text |
...b40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
DIM A B...Green label is used for pb-free packing Pin Style: 1.Gate 2.Drain 3.Source Material: * Lead solder p... |
| Description |
N-Channel Power Field Effect Transistor
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| File Size |
56.98K /
5 Page |
View
it Online |
Download Datasheet |
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HSMC[Hi-Sincerity Mocroelectronics]
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| Part No. |
H05N50 H05N50F H05N50E
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| OCR Text |
...b40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
DIM A B...Green label is used for pb-free packing Pin Style: 1.Gate 2.Drain 3.Source Material: * Lead solder p... |
| Description |
N-CHANNEL POWER MOSFET
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| File Size |
44.53K /
4 Page |
View
it Online |
Download Datasheet |
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Hi-Sincerity Mocroelectronics Corp.
HSMC[Hi-Sincerity Mocroelectronics]
|
| Part No. |
H05N60 H05N60F H05N60E
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| OCR Text |
...b40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
DIM A B...Green label is used for pb-free packing Pin Style: 1.Gate 2.Drain 3.Source Material: * Lead solder p... |
| Description |
N-Channel Power Field Effect Transistor
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| File Size |
56.89K /
5 Page |
View
it Online |
Download Datasheet |
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HSMC[Hi-Sincerity Mocroelectronics]
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| Part No. |
H08N02CTS
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| OCR Text |
...b40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
DIM A A1 b C D E E1 e L S
Min. Max. 1.20 0.05 0.15 0.19 0.3 0.09 0.20 2.90 3.10 6.20 6.60 4.30 4.50 0.65... |
| Description |
Dual N-Channel Enhancement-Mode MOSFET (20V, 8A)
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| File Size |
38.20K /
4 Page |
View
it Online |
Download Datasheet |
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HSMC[Hi-Sincerity Mocroelectronics]
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| Part No. |
H35N03J
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| OCR Text |
...b40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
DIM A C...Green label is used for pb-free packing Pin Style: 1.Gate 2.Drain 3.Source Material: * Lead solder p... |
| Description |
N-Channel Enhancement-Mode MOSFET (25V, 35A)
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| File Size |
85.16K /
5 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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