same-die stacked multi-chip pr pdf Datasheet P13 Description --- IC-ON-LINE


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same-die stacked multi-chip pr Datasheet PDF File

For same-die stacked multi-chip pr Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |

				SAMSUNG SEMICONDUCTOR CO. LTD.
Part No.	K4H2G0638A-UC/LA2 K4H2G0638A-UC/LB0 K4H2G0638A-UC/LB3 K4H2G0638A-UC/LCC
Description	stacked 2Gb A-die SDRAM Specification
File Size	346.63K / 23 Page	View it Online	Download Datasheet

				Renesas
Part No.	M6MGT647M34CKT M6MGB647M34CKT
Description	Memory>MCP(Multi Chip Package)>S-µMCP(stacked micro MCP)
File Size	114.30K / 3 Page	View it Online	Download Datasheet

				Renesas
Part No.	M6MGT641S8BKT M6MGB641S8BKT
Description	Memory>MCP(Multi Chip Package)>S-µMCP(stacked micro MCP)
File Size	42.43K / 3 Page	View it Online	Download Datasheet

				Renesas
Part No.	M6MGT331S4BKT M6MGB331S4BKT
Description	Memory>MCP(Multi Chip Package)>S-µMCP(stacked micro MCP)
File Size	115.73K / 3 Page	View it Online	Download Datasheet

				Renesas
Part No.	M6MGT647M17AKT
Description	Memory>MCP(Multi Chip Package)>S-µMCP(stacked micro MCP)
File Size	112.50K / 3 Page	View it Online	Download Datasheet

				Renesas
Part No.	M6MGD137W34DKT
Description	Memory>MCP(Multi Chip Package)>S-µMCP(stacked micro MCP)
File Size	115.69K / 3 Page	View it Online	Download Datasheet

				Renesas
Part No.	M6MGT331S8BKT M6MGB331S8BKT
Description	Memory>MCP(Multi Chip Package)>S-µMCP(stacked micro MCP)
File Size	52.94K / 3 Page	View it Online	Download Datasheet

				RENESAS
Part No.	M6MGD137W3 M6MGD137W33TP
Description	The M6MGD137W33TP is a stacked micro Multi Chip Package (S- mMCP) that contents 128M-bit Flash memory and 32M-bit Mobile RAM in a 52-pin TSOP.
File Size	50.73K / 3 Page	View it Online	Download Datasheet

				Spansion, Inc. Spansion Inc. ADVANCED MICRO DEVICES INC Advanced Micro Devices, Inc.
Part No.	AM49DL320BGB701T AM49DL320BGT701T AM49DL320BGT701S AM49DL320BGB701S AM49DL320BGT851S AM49DL320BGB701 AM49DL320BGT701 AM49DL320BGB851 AM49DL320BGT70IT AM49DL320BGT70IS AM49DL320BGT85IT
Description	stacked multi-chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous 堆叠式多芯片封装（MCP）闪存和SRAM2兆位个M × 8 2米x 16位）.0伏的CMOS只，同时 stacked multi-chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous 堆叠式多芯片封装（MCP）闪存和SRAM2兆位4个M × 8 2米x 16位）.0伏的CMOS只，同时 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (2M x 16-Bit) Pseudo Static RAM SPECIALTY MEMORY CIRCUIT, PBGA73
File Size	572.99K / 64 Page	View it Online	Download Datasheet

				SAMSUNG[Samsung semiconductor]
Part No.	K4H510738E-TC_LB0 K4H510638E-TC_LA2 K4H510638E-TC_LAA K4H510638E-TC_LB0 K4H510738E K4H510738E-TC_LA2 K4H510738E-TC_LAA
Description	stacked 512Mb E-die DDR SDRAM Specification (x4/x8)
File Size	188.40K / 22 Page	View it Online	Download Datasheet

For same-die stacked multi-chip pr Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |