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Philips Semiconductors / NXP Semiconductors
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| Part No. |
IC03PACKAGES3
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| OCR Text |
...ON
VERSION
PAGE
TSSOP (thin shrink small outline package) TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 m...profile quad flat package; 32 leads; body 7 x 7 x 1.4 mm
Package outlines
SOT358-1
c
y X
... |
| Description |
Package information Package outlines
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| File Size |
279.30K /
35 Page |
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Littelfuse, Inc.
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| Part No. |
434
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| OCR Text |
Thin-Film Surface Mount
SlimLineTM 0603 Very Fast-Acting Fuse 434 Series
* For RoHS compliant and Lead-Free designs use 467 series. * The SlimLine 0603 fuse is an extremely small, low profile design (0603 chip size) utilizing thin-film ... |
| Description |
Surface Mount Fuses - Thin-Film Surface Mount
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| File Size |
37.81K /
1 Page |
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it Online |
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MOTOROLA[Motorola, Inc] MOTOROLA[Motorola Inc]
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| Part No. |
MPXL5010GC7U MPXL5010G8U MPXL5010G7U MPXL5010
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| OCR Text |
...nced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. Features * Low Profile Package * 5.0% Maximum Error over 0... |
| Description |
OPERATING OVERVIEW INTEGRATED PRESSURE SENSOR
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| File Size |
134.02K /
8 Page |
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Conexant
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| Part No. |
11247
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| OCR Text |
...v.80 synchronous access mode thin packages support low profile designs $ssolfdwlrqv usb external modems single design usb worldwide modem modem data pump (mdp) p9373 100-pin tqfp line side device (lsd) (smartdaa) 20463 32-pin tqfp... |
| Description |
Smart HCF-USB modem
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| File Size |
253.94K /
22 Page |
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it Online |
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TOSHIBA
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| Part No. |
TPCL4202
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| OCR Text |
...es features features (1) small, thin package (2) low source-source on-resistance: r ss(on) = 28 m ? (typ.) (v gs = 4.5 v) (3) low leakage...profile for using eutectic solder. figure 9.1.3 shows the recommended temperature profile for using ... |
| Description |
Power MOSFET (N-ch dual)
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| File Size |
392.58K /
12 Page |
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it Online |
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Price and Availability
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