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For underside Found Datasheets File :: 2316    Search Time::1.234ms    
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    CX77144

Skyworks Solutions Inc.
Part No. CX77144
OCR Text ...rature of the GROUND PAD at the underside of the package. Table 2. Recommended Operating Conditions Characteristic Symbol VCC1 Supply Voltage VCC2 VBIAS Reference Voltage PA ON PA OFF Mode Input Impedance > 2.5 k Operating Frequency Cas...
Description Power Amplifier Module for CDMA (887-925 MHz)

File Size 730.52K  /  12 Page

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    LTC6078CMS8 LTC6079CGN LTC6079IGN LTC6078CDD LTC6078 LTC6079HGN LTC6078ACMS8 LTC6078AHMS8 LTC6078AIMS8 LTC6078HMS8 LTC60

LINER
Linear Technology
Part No. LTC6078CMS8 LTC6079CGN LTC6079IGN LTC6078CDD LTC6078 LTC6079HGN LTC6078ACMS8 LTC6078AHMS8 LTC6078AIMS8 LTC6078HMS8 LTC6078IDD LTC6078IMS8 LTC6079 LTC6079CDHC LTC6079IDHC
OCR Text ...IC DFN TJMAX = 125C, JA = 43C/W underside METAL CONNECTED TO V- MS8 PACKAGE 8-LEAD PLASTIC MSOP TJMAX = 150C, JA = 200C/W TOP VIEW OUTA -INA +INA V + TOP VIEW 16 OUTD OUTA -INA +INA V+ +INB -INB OUTB NC 1 2 3 4 5 6 7 8 B C A D ...
Description Micropower Precision, Dual/Quad CMOS Rail-to-Rail Input/Output Amplifi ers

File Size 282.14K  /  20 Page

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    ZXCD50STEVAL

Zetex Semiconductors
Part No. ZXCD50STEVAL
OCR Text ...package. The exposed pad on the underside of the package is soldered down to an area of copper on the PCB, to function as a heatsink. To further assist heat dissipation, the PCB has plated through vias connecting to an area of copper on the...
Description    50W CLASS D AUDIO AMPLIFIER EVALUATION BOARD

File Size 806.24K  /  11 Page

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    PIC24FV32KA30413

Microchip Technology
Part No. PIC24FV32KA30413
OCR Text ...devices. note 1: exposed pad on underside of dev ice is connected to v ss . 2: alternative multiplexing for sda1 (asda1) and scl1 (ascl1) when the i2csel configuration bit is set. 3: pic24f32ka304 device pins have a maximum vo ltage of 3.6v...
Description 20/28/44/48-Pin, General Purpose, 16-Bit Flash Microcontrollers with XLP Technology

File Size 4,330.93K  /  364 Page

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