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  138-94411 Datasheet PDF File

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    STMICROELECTRONICS[STMicroelectronics]
Part No. L6280 1387
Description From old datasheet system
THREE CHANNELS MULTIPOWER DRIVER SYSTEM

File Size 386.23K  /  26 Page

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Amphenol Communications Solutions

Part No. 93944-112HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Molex Inc.
Part No. 31387-2002
Description
File Size 30.95K  /  2 Page

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Amphenol Communications Solutions

Part No. 93944-116HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    6N138 6N139

Isocom Components, Ltd.
Part No. 6N138 6N139
Description High Speed Optically Coupled Isolator PhotoDarlington Output(高速达林顿输出的光耦合/隔离 1 CHANNEL LOGIC OUTPUT OPTOCOUPLER, 0.3 Mbps

File Size 67.58K  /  4 Page

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Amphenol Communications Solutions

Part No. 93944-115HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 15 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    6N139 6N138

Marktech Optoelectronics
MARKTECH[Marktech Corporate]
Part No. 6N139 6N138
Description PHOTOCOUPLER

File Size 107.36K  /  3 Page

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Amphenol Communications Solutions

Part No. 93944-110HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    6N139 6N138

Siemens Semiconductor Group
Part No. 6N139 6N138
Description LOW INPUT CURRENT, HIGH GAIN OPTOCOUPLER

File Size 23.59K  /  2 Page

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Amphenol Communications Solutions

Part No. 93944-111HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 11 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    NXP Semiconductors N.V.
Part No. BT138-800G
Description 4Q Triac

File Size 135.47K  /  8 Page

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Amphenol Communications Solutions

Part No. 93944-119HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 19 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    31389-1207

Molex Electronics Ltd.
Part No. 31389-1207
Description 2.54mm Pitch, 0.64mm Width HDAC 64 High Density Automotive Connectors, Dual

File Size 40.04K  /  1 Page

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Amphenol Communications Solutions

Part No. 93944-117HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 17 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    51382-0500

Molex Electronics Ltd.
Part No. 51382-0500
Description 2.00mm Pitch MicroClasp?Wire-to-Board Receptacle Housing, Positive Lock, Single

File Size 33.47K  /  1 Page

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Amphenol Communications Solutions

Part No. 93944-114HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    51382-1000

Molex Electronics Ltd.
Part No. 51382-1000
Description 2.00mm Pitch MicroClasp?Wire-to-Board Receptacle Housing, Positive Lock, Single

File Size 33.46K  /  1 Page

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Amphenol Communications Solutions

Part No. 93944-118HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 18 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    51382-0900

Molex Electronics Ltd.
Part No. 51382-0900
Description 2.00mm Pitch MicroClasp?Wire-to-Board Receptacle Housing, Positive Lock, Single

File Size 33.46K  /  1 Page

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