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  70567-0018 Datasheet PDF File

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    15-80-0325 A-70567-0150 0015800325

Molex Electronics Ltd.
Part No. 15-80-0325 A-70567-0150 0015800325
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.25K  /  7 Page

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Amphenol Cables on Demand

Part No. CS-DSDHD44MF0-001.8M
Description Amphenol CS-DSDHD44MF0-001.8M 44-Pin (HD44) Deluxe HD D-Sub Cable - Copper Shielded - Male / Female 1.8m (6-feet)
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0015800149 15-80-0149 A-70567-0277

Molex Electronics Ltd.
Part No. 0015800149 15-80-0149 A-70567-0277
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.39K  /  7 Page

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Amphenol Communications Solutions

Part No. 10060018-10202TLF
Description PCI Express® GEN 1 Card Edge, Storage and Server Connector, Vertical, Press-Fit, x8, 98 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    0015800147 15-80-0147 A-70567-0209

Molex Electronics Ltd.
Part No. 0015800147 15-80-0147 A-70567-0209
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating

File Size 1,218.31K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021121-00018D1LF
Description Minitek127®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 18Positions, 1.27mm (0.5inch) pitch.
Tech specs    

Official Product Page

    70567-0151 0015800345

Molex Electronics Ltd.
Part No. 70567-0151 0015800345
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 34 Circuits

File Size 1,218.29K  /  7 Page

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Amphenol Communications Solutions

Part No. 10018783-11112TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x8, 98 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    0015800165 15-80-0165 70567-0142 A-70567-0142

Molex Electronics Ltd.
Part No. 0015800165 15-80-0165 70567-0142 A-70567-0142
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating,

File Size 1,218.25K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021321-10018T4LF
Description SMT TYPE RECEPTACLE
Tech specs    

Official Product Page

    0015800169 15-80-0169 A-70567-0278

Molex Electronics Ltd.
Part No. 0015800169 15-80-0169 A-70567-0278
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.39K  /  7 Page

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Amphenol Communications Solutions

Part No. 10119109-210018LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 10 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    A-70567-0363 15-80-1501 0015801501

Molex Electronics Ltd.
Part No. A-70567-0363 15-80-1501 0015801501
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating

File Size 1,218.39K  /  7 Page

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Amphenol Communications Solutions

Part No. 10018783-10003TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    70567-0152 A-70567-0152 15-80-0365 0015800365

Molex Electronics Ltd.
Part No. 70567-0152 A-70567-0152 15-80-0365 0015800365
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits

File Size 1,218.29K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021321-10018C4LF
Description SMT TYPE RECEPTACLE
Tech specs    

Official Product Page

    TR636E-10018

Hirose Electric
Part No. TR636E-10018
Description COMPREHENSIVE TEST REPORT

File Size 844.87K  /  40 Page

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Amphenol Communications Solutions

Part No. 10018783-00101TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x4, 64 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    ITMSMM-S0018

OPLINK Communications Inc.
Part No. ITMSMM-S0018
Description 850nm Window Multi-mode Single Channel Integrated Tap Monitors

File Size 156.47K  /  2 Page

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Amphenol Communications Solutions

Part No. 55510-018LF
Description <span style=\\background-color: #FFFF00\\><b>PREFERRED P/N SERIES FOR NEW PROJECT: 10131937</b></span><br><br>Minitek® 2.00mm, Board to Board Connector, PCB Mounted Receptacle , Vertical , Surface Mount, Double row, 18 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

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