|
|
![](images/bg04.gif) |
Amphenol Communications Solutions |
Part No. |
131-6216-11D
|
Description |
Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
![](images/bg04.gif) |
Advanced Interconnections, Corp.
|
Part No. |
2SA1316GR
|
Description |
5-Pin µP Supervisory Circuits with Watchdog and Manual Reset 5个引amp;#181;带看门狗和手动复位的P监控电路
|
File Size |
240.51K /
5 Page |
View
it Online |
Download Datasheet
|
|
|
![](images/bg04.gif) |
Amphenol Communications Solutions |
Part No. |
131-6518-11D
|
Description |
Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
![](images/bg04.gif) |
Amphenol Communications Solutions |
Part No. |
131-6314-11H
|
Description |
Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Left End Wall, Backplane Module, 1.5mm Wipe, APP.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
![](images/bg04.gif) |
Amphenol Communications Solutions |
Part No. |
131-6616-11H
|
Description |
Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Right Polarized, Backplane Module, 1.5mm Wipe, APP.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
![](images/bg04.gif) |
Amphenol Communications Solutions |
Part No. |
131-6318-21D
|
Description |
Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Left End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
![](images/bg04.gif) |
Amphenol Communications Solutions |
Part No. |
131-6114-21H
|
Description |
Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
![](images/bg04.gif) |
![0901301316 90130-1316](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd. http://
|
Part No. |
0901301316 90130-1316
|
Description |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 16 Circuits, Black, 0.76μm (30μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Vertical, Shrouded, Fully Loaded, 16 Circuits, Black, 0.76μm (30μ) Gold (Au) Selective Plating
|
File Size |
585.96K /
7 Page |
View
it Online |
Download Datasheet
|
|
|
![](images/bg04.gif) |
Mitsubishi Electric Corporation MITSUBISHI[Mitsubishi Electric Semiconductor] Hitec RCD USA, Inc.
|
Part No. |
M61316SP M61311SP
|
Description |
Bus Controlled 3ch Video Amp (15OMHz) I2C BUS CONTROLLED VIDEO PRE-AMP FOR HIGH RESOLUTION COLOR DISPLAY I2C总线控制的视频预先登记的高分辨率显示屏放大器
|
File Size |
217.70K /
22 Page |
View
it Online |
Download Datasheet
|
|
![](images/bom2buy.png)
Bom2Buy.com
![](images/findchips_sm.gif)
Price and Availability
|