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Molex Electronics Ltd.
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| Part No. |
0702461402 70246-1402
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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| File Size |
175.77K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10061402-10010TLF
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| Description |
PCI Express® GEN 1 Card Edge, Storage and Server Connector, Vertical, Press-Fit, x8, 98 Positions, 1.00mm (0.039in) Pitch
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
61082-161409LF
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| Description |
BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 160 Positions.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
61082-061409LF
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| Description |
BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 60 Positions.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0702461404 70246-1404
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.127渭m (5渭") Gold (Au) Plating, Tin (Sn) PC TailPlating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.127μm (5μ) Gold (Au) Plating, Tin (Sn) PC TailPlating
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| File Size |
176.00K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54122-106140950LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 14 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0702461401 70246-1401
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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| File Size |
175.77K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54122-410161400LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
59112-T3806-1400LF
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| Description |
Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 6 Positions.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
861400081LO1705LF
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| Description |
Board to Board connector, Unshrouded Header, Through Hole, Single Row, 8 Position, Right Angle.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
861400722LO10LF
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| Description |
Board to Board connector, Unshrouded Header, Through Hole, Double Row, 72 Position, Right Angle.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
861400021YO2LF
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| Description |
Board to Board connector, Unshrouded Header, Through Hole, Single Row, 2 Position, Vertical.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
861400041YO2090LF
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| Description |
Board to Board connector, Unshrouded Header, Through Hole, Single Row, 4 Position, Vertical.
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Official Product Page
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Price and Availability
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