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baseplate Datasheet PDF File

For baseplate Found Datasheets File :: 3114 Search Time::0.844ms
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				Mitsubishi Electric Semiconductor
Part No.	CM100DY-12H
OCR Text	... isolated from the heat sinking baseplate, offering simplified system assembly and thermal management. Features: Low Drive Power Low VCE(sat) Discrete Super-Fast Recovery Free-Wheel Diode High Frequency Operation Isolated baseplate for Easy...
Description	HIGH POWER SWITCHING USE INSULATED TYPE
File Size	46.29K / 4 Page	View it Online	Download Datasheet

				Powerex Power Semiconductors
Part No.	CM50DU-24F
OCR Text	... isolated from the heat sinking baseplate, offering simplified system assembly and thermal management. Features: Low Drive Power Low VCE(sat) Discrete Super-Fast Recovery Free-Wheel Diode Isolated baseplate for Easy Heat Sinking Applica...
Description	Trench Gate Design Dual IGBTMOD?/a> 50 Amperes/1200 Volts Trench Gate Design Dual IGBTMOD⑩ 50 Amperes/1200 Volts Trench Gate Design Dual IGBTMOD 50 Amperes/1200 Volts
File Size	100.75K / 4 Page	View it Online	Download Datasheet

				Mitsubishi Electric Corporation Mitsubishi Electric Semiconductor
Part No.	CM50DU-24H
OCR Text	... isolated from the heat sinking baseplate, offering simplified system assembly and thermal management. Features: Low Drive Power Low VCE(sat) Discrete Super-Fast Recovery Free-Wheel Diode High Frequency Operation Isolated baseplate for Easy...
Description	IGBT Modules:1200V MEDIUM POWER SWITCHING USE INSULATED TYPE
File Size	50.05K / 4 Page	View it Online	Download Datasheet

				Powerex Power Semiconductors
Part No.	QIS0660004
OCR Text	...isolated from the heat sinking baseplate, offering simplified system assembly and thermal management. features: alsic baseplate low drive power low v ce(sat) discrete super-fast recovery free-wheel diode isolated bas...
Description	Single IGBTMOD NX-Series Module 600 Amperes/600 Volts
File Size	573.91K / 5 Page	View it Online	Download Datasheet

				Mitsubishi Electric Semiconductor
Part No.	CM400DY-12H
OCR Text	... isolated from the heat sinking baseplate, offering simplified system assembly and thermal management. Features: Low Drive Power Low VCE(sat) Discrete Super-Fast Recovery Free-Wheel Diode High Frequency Operation Isolated baseplate for Easy...
Description	HIGH POWER SWITCHING USE INSULATED TYPE
File Size	48.85K / 4 Page	View it Online	Download Datasheet

				Mitsubishi Electric Corporation MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No.	CM75DY-12H
OCR Text	... isolated from the heat sinking baseplate, offering simplified system assembly and thermal management. Features: Low Drive Power Low VCE(sat) Discrete Super-Fast Recovery Free-Wheel Diode High Frequency Operation Isolated baseplate for Easy...
Description	IGBT Modules: 600V HIGH POWER SWITCHING USE INSULATED TYPE
File Size	47.44K / 4 Page	View it Online	Download Datasheet

				VICOR[Vicor Corporation] Vicor, Corp.
Part No.	MICRORAM URAM2H21 URAM2C21 URAM3TS3 URAM2C11 URAM2C12 URAM2C13 URAM2C22 URAM2C23 URAM2CN1 URAM2CN2 URAM2CN3 URAM2CS1 URAM2CS2 URAM2CS3 URAM2H11 URAM2H12 URAM2H13 URAM2H22 URAM2H23 URAM2HN1 URAM2HN2 URAM2HN3 URAM2HS1 URAM2HS2 URAM2HS3 URAM2M11 URAM2M12 URAM2M13 URAM2M21 URAM2M22 URAM2M23 URAM2MN1 URAM2MN2 URAM2MN3 URAM2MS1 URAM2MS2 URAM2MS3 URAM2T11 URAM2T12 URAM2T13 URAM2T21 URAM2T22 URAM2T23 URAM2TN1 URAM2TN2 URAM2TN3 URAM2TS1 URAM2TS2 URAM2TS3 URAM3C11 URAM3C12 URAM3C13 URAM3C21 URAM3C22 URAM3C23 URAM3CN1 URAM3CN2 URAM3CN3 URAM3CS1 URAM3CS2 URAM3CS3 URAM3H11 URAM3H12 URAM3H13 URAM3H21 URAM3H22 URAM3H23 URAM3HN1 URAM3HN2 URAM3HN3 URAM3HS1 URAM3HS2 URAM3HS3 URAM3M11 URAM3M12 URAM3M13 URAM3M21 URAM3M22 URAM3M23 URAM3MN1 URAM3MN2 URAM3MN3 URAM3MS1 URAM3MS2 URAM3MS3 URAM3T11 URAM3T12 URAM3T13 URAM3T21 URAM3T22 URAM3T23 URAM3TN1 URAM3TN2 URAM3TN3 URAM3TS1 URAM3TS2
OCR Text	...ve solder 7 sec; wave solder baseplate baseplate baseplate Thermal Resistance Parameter baseplate to sink; flat, greased surface baseplate to sink; with thermal pad (P/N 20264) baseplate to ambient baseplate to ambient; 1000 LFM Typ ...
Description	Output Ripple Attenuation Module Temperature Range:-40 C to 85 C; Capacitance:4700uF RoHS Compliant: Yes O-RING, METALOK BANTAM; Temp, op. max:125(degree C); Temp, op. min:-55(degree C); Series:METALOK BANTAM Output Ripple Attenuation Module 输出纹波衰减模块 Crimp Socket Contact; Wire Size (AWG):28; Contact Size:16; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes
File Size	1,180.91K / 8 Page	View it Online	Download Datasheet

				Powerex Power Semiconductors
Part No.	CM200DY-34A
OCR Text	...isolated from the heat sinking baseplate, offering simplified system assembly and thermal management. features: low drive power low v ce(sat) discrete super-fast recovery free-wheel diode isolated baseplate for easy heat si...
Description	Dual IGBTMOD A-Series Module 200 Amperes/1700 Volts
File Size	255.74K / 4 Page	View it Online	Download Datasheet

				SYNQOR INC
Part No.	HPV60NRS-G
OCR Text	...rature range is -40 c to +100 c baseplate temperature with appropriate power derating. specifcations subject to change without notice. parameter min. typ. max. units notes & conditions absolute maximum ratings input voltage non-ope...
Description	1-OUTPUT 198 W DC-DC REG PWR SUPPLY MODULE
File Size	1,605.49K / 27 Page	View it Online	Download Datasheet

				SYNQOR INC
Part No.	HPV60NRS-G
OCR Text	... is -40 c to +100 c baseplate temperature with appropriate power derating. specifcations subject to change without notice. parameter min. typ. max. units notes & conditions absolute maximum ratings in...
Description	1-OUTPUT 108 W DC-DC REG PWR SUPPLY MODULE
File Size	953.78K / 29 Page	View it Online	Download Datasheet

For baseplate Found Datasheets File :: 3114 Search Time::0.844ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |

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