| |
|
 |
Toshiba Electronic Devices & Storage Corporation |
| Part No. |
2SA1162
|
| Description |
PNP Bipolar Transistor / VCEO=-50 V / IC=-0.15 A / hFE=70~400 / VCE(sat)=-0.3 V / AEC-Q101 / SOT-346
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
79821-162HLF
|
| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 62 Positions, 2.54 mm Pitch, Vertical, 10.92 mm (0.43 in.) Mating, 5.08 mm (0.2 in.) Tail.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Electronic Theatre Controls, Inc.
|
| Part No. |
CSC1162B
|
| Description |
TRANSISTOR | BJT | NPN | 35V V(BR)CEO | 2.5A I(C) | TO-126 晶体管|晶体管|叩| 35V的五（巴西）总裁| 2.5AI（丙）|26
|
| File Size |
38.17K /
3 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
131-5116-21D
|
| Description |
Paladin® 112Gb/s Backplane Connector, 5-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
131-4116-21H
|
| Description |
Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
77311-162-36LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
10127721-162GLF
|
| Description |
Minitek® Pwr 3.0, Dual Row, Vertical Through Hole Header, 16 Position, 3.2mm Kink Tail (Gold Flash) plating, GW Compatible LCP, Black Color,Tray Packing.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
75168-116-20LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 20 Positions, 2.54mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
International Rectifier, Corp.
|
| Part No. |
2SC1162C
|
| Description |
SC70/µDFN, Single/Dual Low-Voltage, Low-Power µP Reset Circuits 晶体管|晶体管|叩| 35V的五（巴西）总裁| 2.5AI（丙）|26
|
| File Size |
24.15K /
5 Page |
View
it Online |
Download Datasheet |
| |
|
|
Amphenol Communications Solutions |
| Part No. |
54242-811162350LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
131-3116-21D
|
| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
131-8116-21D
|
| Description |
Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
|
| Tech specs |
|
|
|
Official Product Page
|
|
Bom2Buy.com
Price and Availability
|
