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PARA LIGHT ELECTRONICS CO.,...
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Part No. |
EP503IR4L076W
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OCR Text |
... electrical contact. apply heat-dissipating paste here solder pad solder mask 1 1 . 6 5 1 6 . 6 5 5 . 8 2 6 . 4 0 2 * 1.50 2 * 1.15 note: 1. all dimensions are in millimeters . 2. the drawings are not to scale. 3. solder ... |
Description |
Enhance Power LED
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File Size |
160.45K /
12 Page |
View
it Online |
Download Datasheet |
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PARA LIGHT ELECTRONICS CO.,...
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Part No. |
EP503IR4L077W
|
OCR Text |
... electrical contact. apply heat-dissipating paste here solder pad solder mask 1 1 . 6 5 1 6 . 6 5 5 . 8 2 6 . 4 0 2 * 1.50 2 * 1.15 note: 1. all dimensions are in millimeters . 2. the drawings are not to scale. 3. solder ... |
Description |
Enhance Power LED
|
File Size |
160.72K /
12 Page |
View
it Online |
Download Datasheet |
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ST Microelectronics STMICROELECTRONICS[STMicroelectronics]
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Part No. |
DIP40
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OCR Text |
...
60
die size 35000 sq. mils dissipating area 2000 sq. mils 2 s 1 Oz. board
55
50 0 0.5 1 1.5 dissipated power ( Watt ) 2 2.5 3
Zth( C/W)
2)
10
die size 35000 sq. mils dissipating area 2000 sq. mils 2s 1Oz. board 2 w sing... |
Description |
Thermal Data
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File Size |
28.99K /
2 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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