Part Number Hot Search : 
BZX97C27 HIN206E 2SK313 MSC60 BC6033SQ FDU6696 VSK71 CY7C102
Product Description
Full Text Search
  HDMP-1636 Datasheet PDF File

For HDMP-1636 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

    K7K1636T2C K7K1618T2C

Samsung semiconductor
Part No. K7K1636T2C K7K1618T2C
Description 512Kx36 & 1Mx18 DDRII CIO b2 SRAM

File Size 440.39K  /  19 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 61082-163602LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 160 Positions.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    K7S1636T4C K7S1618T4C

Samsung semiconductor
Part No. K7S1636T4C K7S1618T4C
Description 512Kx36 & 1Mx18 QDR II b4 SRAM

File Size 377.84K  /  20 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 75168-316-36LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    K7K1636U2C K7K1618U2C

Samsung semiconductor
Part No. K7K1636U2C K7K1618U2C
Description 512Kx36 & 1Mx18 DDRII CIO b2 SRAM

File Size 415.85K  /  19 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 61083-163622LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

    SAMSUNG ELECTRONICS
Part No. K7A161830B K7A163630B
Description 512Kx36 & 1Mx18 Synchronous SRAM

File Size 405.40K  /  19 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 61082-163600LF
Description 0.8MM B TO B REC ASSY
Tech specs    

Official Product Page

    K7I163684B K7I161884B

Samsung semiconductor
Part No. K7I163684B K7I161884B
Description 512Kx36 & 1Mx18 DDRII CIO b4 SRAM

File Size 417.62K  /  18 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 61083-163600LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

    K7Z167288B K7Z163688B

Samsung semiconductor
Part No. K7Z167288B K7Z163688B
Description 512Kx36 & 256Kx72 DLW(Double Late Write) RAM

File Size 239.63K  /  20 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 61083-163602LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

    Samsung Electronic
SAMSUNG[Samsung semiconductor]
SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K7Q163652A K7Q161852A
Description 512Kx36 & 1Mx18 QDRTM b2 SRAM
Electrical Outlet Connector; Voltage Rating:125V; Contact Plating:Nickel; Current Rating:30A RoHS Compliant: Yes 512Kx36

File Size 503.77K  /  17 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 75168-116-36LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    K7K1618U2C K7K1636U2C

Samsung semiconductor
Part No. K7K1618U2C K7K1636U2C
Description 512Kx36 & 1Mx18 DDRII CIO b2 SRAM

File Size 454.05K  /  19 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. RJMG163618101NR
Description RJMG, Input output Connectors, 1x1,10/100 with LEDs
Tech specs    

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K7M161825M K7M163625M
Description 512Kx36 & 1Mx18 Flow-Through NtRAM-TM

File Size 355.71K  /  20 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 61082-163622LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 160 Positions.
Tech specs    

Official Product Page

    http://
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K7N161845M K7N163645M
Description 512Kx36 & 1Mx18-Bit Pipelined NtRAMTM 512Kx36
512Kx36 & 1Mx18-Bit Pipelined NtRAMTM

File Size 470.55K  /  20 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. UE86G16360033T
Description XCede I/O, High Speed Input Output Connectors, 1X1 XCede IO COMBO.
Tech specs    

Official Product Page

For HDMP-1636 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

▲Up To Search▲

 



Bom2Buy.com




Price and Availability



JITONG TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor

Part: HDMP-1636A
Maker: AGILENT
Pack: QFP64
Stock: 2832
Unit price for :
    50: $4.65
  100: $4.42
1000: $4.19

Email: oulindz@gmail.com

Contact us

 
Price & Availability of HDMP-1636

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X
0.19334101676941