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    TJA1010 TJA1010T

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. TJA1010 TJA1010T
OCR Text ...eviously written, faults can be localized and identified (e.g. open load at driver stage number 5). Protection of DMOS outputs Each driver contains a DMOS power FET. The drivers are protected against overvoltage, short-circuit and overtempe...
Description Octal Low Side Driver OLSD

File Size 105.29K  /  16 Page

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    STLC5445

STMICROELECTRONICS[STMicroelectronics]
Part No. STLC5445
OCR Text ...ults can easily be detected and localized even in a large system. The status conditions detected by the device are: Current Overload, Thermal Overload, Open Loop. If activated (by means of a dedicated pin strap), a self generated power on s...
Description QUAD LINE FEED CONTROLLER

File Size 212.61K  /  23 Page

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    PD100MC0MP PD100MC0MP1

Sharp Electrionic Components
Part No. PD100MC0MP PD100MC0MP1
OCR Text ...ts, such heat sources may cause localized high temperatures in the part's resin. be sure to keep the temperature profile within the guidelines shown in fig. 4. 4. if hand soldering, use temperatures 260 for 3 seconds. do not dip-solder ...
Description Surface Mount Type, Transparent Resin Photodiode

File Size 501.84K  /  10 Page

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    PD100MF0MP PD100MF0MP1

Sharp Electrionic Components
Part No. PD100MF0MP PD100MF0MP1
OCR Text ...ts, such heat sources may cause localized high temperatures in the part's resin. be sure to keep the temperature profile within the guidelines shown in fig. 4. 4. if hand soldering, use temperatures 260 for 3 seconds. do not dip-solder ...
Description Surface Mount Type, Opaque Resin Photodiode

File Size 501.99K  /  10 Page

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    SGS Thomson Microelectronics
Part No. AN328
OCR Text ...urn-on, the dissipated power is localized in the protection component (the transil is made for that !). the triac is turned on by a gate current which will ensure optimal di/dt conditons. the results we have carried out tests with repetitiv...
Description PROTECT YOUR TRIACS

File Size 36.50K  /  4 Page

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Part No. CBC-EVAL-05
OCR Text ..., low duty cycle applications. localized power source ? to keep microcontrollers and other devices alert in standby mode. power bridging ? to provide back-up power to system during exchange of main batteries. consumer appliances ? ...
Description EnerChip?/a> CC CBC3112 & CBC3150 Evaluation Kit

File Size 725.88K  /  4 Page

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Part No. AN-9037
OCR Text ... printed with a mini stencil. localized hot air can then be applied to reflow the solder and make the joint. due to the thermal performance of this component, and the typical high performance pwb it will be mounted on, quite a bit of...
Description 8x8 MLP DriverMOS Packaging

File Size 749.51K  /  7 Page

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Part No. AN-9040
OCR Text ... printed with a mini stencil. localized hot air can then be applied to reflow the solder and make the joint. due to the thermal performance of this component, and the typical high performance pwb it will be mounted on, quite a bit of...
Description Power33 Packaging

File Size 299.73K  /  7 Page

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Part No. AN-9046
OCR Text ... printed with a mini stencil. localized hot air can then be applied to reflow the solder and make the joint. due to the thermal performance of this component, and the typical high performance pwb it will be mounted on, quite a bit of...
Description Dual Power56 Packaging

File Size 850.15K  /  10 Page

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Part No. AN-9048
OCR Text ... printed with a mini stencil. localized hot air can then be applied to reflow the solder and make the joint. due to the thermal performance of this component, and the typical high performance pwb it will be mounted on, quite a bit of...
Description 6x6 DriverMOS Packaging

File Size 746.79K  /  9 Page

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