MJR28N2NNA0-G300 pdf Datasheet P14 Part Num --- IC-ON-LINE


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MJR28N2NNA0-G300 Datasheet PDF File

For MJR28N2NNA0-G300 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |

					Powerex Power Semicondu...
Part No.	MIG300Q2CMB1X
Description	Compact IPM Series
File Size	217.41K / 6 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54202-G3003ALF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 6 Positions, 2.54 mm (0.100in) Pitch.
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Mitsubishi Electric Semiconductor
Part No.	MIG300Q2CMB1X
Description	AC MOTOR CONTROLLER, 300 A, UFM11 High Power Switching Applications Motor Control Applications
File Size	191.72K / 9 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54101-G30-00
Description	BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 0 Positions, 2.54 mm Pitch.
Tech specs				Official Product Page

					FAIRCHILD[Fairchild Semiconductor] Fairchild Semiconductor Corporation
Part No.	FMBL1G300US60
Description	IGBT Molding Type Module BK Precision Sweep/Function Generators, Waveforms: Sine, Square, Triangle, /- Pulse, /- Ramp, Frequency Range: .2 Hz-20 MHz, Resolution: 5 Digits, Tuning Range: 10:1, Impedance: 50 Ohm, Attenuation: -20 /-1 dB
File Size	691.70K / 9 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54102-G3007B03LF
Description	BERGSTIK 0.100\\ HEADER-ALTERNATE 77313-122-14LF
Tech specs				Official Product Page

					Taiyo Yuden (U.S.A.), I...
Part No.	UMK063CG300JT-F
Description	Standard Multilayer Ceramic Capacitors (Temperature compensating type)
File Size	282.84K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	59112-G30-05-050
Description	Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 10 Positions.
Tech specs				Official Product Page

					Taiyo Yuden (U.S.A.), I...
Part No.	EMK042CG300JC-W
Description	Standard Multilayer Ceramic Capacitors (Temperature compensating type)
File Size	129.73K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	59132-G30-05-071LF
Description	Minitek® 2.00mm, Board to Board Connector, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 10 Positions, 2.00mm (0.079in) Pitch
Tech specs				Official Product Page

					MURATA MANUFACTURING CO LTD
Part No.	BLM21PG300SH1
Description	1 FUNCTIONS, 3 A, FERRITE CHIP
File Size	59.62K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	59202-G30-05-084LF
Description	Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 10 Positions.
Tech specs				Official Product Page

					TOSHIBA
Part No.	MIG300J2CSB1W
Description	Intelligent Power Module Silicon N Channel IGBT High Power Switching Applications Motor Control Applications
File Size	163.04K / 10 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	59112-G30-06-066
Description	Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 12 Positions.
Tech specs				Official Product Page

					Fairchild Semiconductor
Part No.	FMG1G300US60H
Description	600V, 300A IGBT Module (Molding Type)
File Size	491.78K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54101-G3000LF
Description	BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 0 Positions, 2.54 mm Pitch.
Tech specs				Official Product Page

					Fairchild Semiconductor
Part No.	FMG1G300US60L
Description	600V, 300A IGBT Module (Molding Type)
File Size	492.02K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	59132-G30-09-065LF
Description	Minitek® 2.00mm, Board to Board Connector, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 18 Positions, 2.00mm (0.079in) Pitch
Tech specs				Official Product Page

					Fairchild Semiconductor
Part No.	FMG2G300US60E
Description	600V, 300A IGBT Module (Molding Type) Molding Type Module
File Size	717.62K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	59202-G30-08-052
Description	Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 16 Positions.
Tech specs				Official Product Page

For MJR28N2NNA0-G300 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |

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