4304.4067 pdf Datasheet P15 Part Num --- IC-ON-LINE

Texas Instruments

Part No.

THS4304DG4

Description

3GHz, Low noise, Wideband Operational Amplifier 8-SOIC -40 to 85

Tech specs

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4304.4067 Datasheet PDF File

For 4304.4067 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |

				Molex Electronics Ltd.
Part No.	44067-1602 0440671602
Description	3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
File Size	204.16K / 3 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	44067-1601 0440671601
Description	3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
File Size	204.11K / 3 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	44067-1603 0440671603
Description	3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
File Size	203.98K / 3 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	44067-1203 0440671203
Description	3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating 3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 12 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selecti
File Size	204.16K / 3 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	44067-1202 0440671202
Description	3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
File Size	204.16K / 3 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	44067-1201 0440671201
Description	3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 12 Circuits, Tin (Sn) Plating 3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 12 Circuits, Tin (Sn) Plating
File Size	204.11K / 3 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	44067-0802 0440670802
Description	3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick
File Size	204.16K / 3 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	44067-0603 0440670603
Description	3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
File Size	204.16K / 3 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	0440672001 44067-2001
Description	3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 20 Circuits, Tin (Sn) Plating MOLEX Connector
File Size	204.09K / 3 Page	View it Online	Download Datasheet

For 4304.4067 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |