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  571-4235 Datasheet PDF File

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    HDSP-B571 HDSP-B573

Agilent(Hewlett-Packard)
Part No. HDSP-B571 HDSP-B573
Description Dot Matrix Displays 5 x 7 Bi-Color General Purpose Dot Matrix Displays 53.2 mm (2.09 inch) Package

File Size 199.62K  /  6 Page

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Amphenol Communications Solutions

Part No. 74423-550LF
Description Assembly, Bottom Mount, S/D(68Pins), VTB, 3.3V, 5mm s/o, non-Eject
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Cirrus Logic, Inc.
AGILENT TECHNOLOGIES INC
Part No. HDSP-H571 HDSP-H573
Description ASDX Series, amplified, bidirectional, 0 psi to 15 psi operating pressure, "D4" DIP package, straight port 53.2毫米.09英寸)通用5X7点阵的字母数字显示器
5X7 DOT MATRIX DISPLAY, HIGH EFFICIENCY RED, 53.2 mm

File Size 238.63K  /  7 Page

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Amphenol Communications Solutions

Part No. 68004-235HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail.
Tech specs    

Official Product Page

    http://
Part No. 90571-2203
Description 2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, 20 Circuits, 0.25 μm Gold (Au)

File Size 358.67K  /  5 Page

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Amphenol Communications Solutions

Part No. 76342-350LF
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Top Entry, Double Row , 100 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    45719-0009

Molex Electronics Ltd.
Part No. 45719-0009
Description 12.90mm (.508") Pitch EXTreme PowerEdge?? Connector, 4 Segments (8 Total Contacts), Through Hole Solder for 1.57mm (.062") Thick PC Board, Mates to a 1.57mm (.0
12.90mm (.508) Pitch EXTreme PowerEdge? Connector, 4 Segments (8 Total Contacts), Through Hole Solder for 1.57mm (.062) Thick PC Board, Mates to a 1.57mm (.062) Thick Card Edge or Bus Bar Tab

File Size 239.95K  /  5 Page

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Amphenol Communications Solutions

Part No. 68024-235HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 3.81 mm (0.15in) Tail.
Tech specs    

Official Product Page

    http://
Part No. 90571-2169
Description 2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, 16 Circuits, Tin

File Size 350.59K  /  5 Page

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Amphenol Communications Solutions

Part No. 74423-520LF
Description Assembly, Bottom Mount, S/D(68Pins), VTB, 3.3V, 2.2mm s/o, non-Eject
Tech specs    

Official Product Page

    http://
Part No. 90571-2409
Description 2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, 40 Circuits, Tin

File Size 350.59K  /  5 Page

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Amphenol Communications Solutions

Part No. 88954-235LF
Description Metral® Board Connectors, Backplane Connectors, 4 Row Signal Header, Straight, Solder-to-Board, Wide body.
Tech specs    

Official Product Page

    http://
Part No. 90571-2209
Description 2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, 20 Circuits, Tin

File Size 350.59K  /  5 Page

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Amphenol Communications Solutions

Part No. 68604-235HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 35 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    http://
Part No. 90571-2269
Description 2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, 26 Circuits, Tin

File Size 350.59K  /  5 Page

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    http://
Part No. 90571-1501
Description 2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 50 Circuits, 0.1 μm Gold (Au)

File Size 282.87K  /  4 Page

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    52435-2571

Molex Electronics Ltd.
Part No. 52435-2571
Description 0.50mm (.020) Pitch SMT Right-Angle FFC/FPC Connector, 25 Circuits, Gold (AuContact Plating

File Size 409.44K  /  7 Page

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