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  71764-0116 Datasheet PDF File

For 71764-0116 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

    0014601162

Molex Electronics Ltd.
Part No. 0014601162
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female,Single Row, Version D, Back Ribs, Wire Size 28, 3.81μm (150μ) Tin/Lead (SnPb), 16 Circuits

File Size 156.04K  /  3 Page

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Amphenol Communications Solutions

Part No. 76345-301-16LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Double row , 16 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0307001167 30700-1167

Molex Electronics Ltd.
Part No. 0307001167 30700-1167
Description 2.54mm (.100) Pitch, 0.64mm (.025) Width H-DAC 64 High Density AutomotiveConnectors, Dual Row, Female Harness Assembly, 16 Circuits, Polarization Option 1Gray

File Size 479.62K  /  4 Page

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Amphenol Communications Solutions

Part No. 10116658-152FSLF
Description DDR2 SO-DIMM, Storage and Server Connector, Right Angle, Surface Mount, 200 Position, Standard Type, 0.60mm (0.024in) Pitch
Tech specs    

Official Product Page

    0736440116 73644-0116

Molex Electronics Ltd.
Part No. 0736440116 73644-0116
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position N/A, 72 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position N/A, 72 Circuits

File Size 166.79K  /  4 Page

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Amphenol Communications Solutions

Part No. 70430-116LF
Description Metral® Power Connectors, Backplane Power Connectors, 5 Row Power Header,Vertical Press-Fit, Wide body.
Tech specs    

Official Product Page

    IBM Microeletronics
Part No. IBM0116165
Description 1M x 16 12/8 EDO DRAM(16M动态RAM(超页面模式读写并带20条地址线,其中12条为行地址选通,8条为列地址选通))

File Size 383.15K  /  31 Page

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Amphenol Communications Solutions

Part No. 20021521-00116C1LF
Description Minitek127®, Shrouded Board to Board Header, Surface Mount, 16 positions, 1.27mm (0.500in) pitch.
Tech specs    

Official Product Page

    0307001168 30700-1168

Molex Electronics Ltd.
Part No. 0307001168 30700-1168
Description 2.54mm (.100) Pitch, 0.64mm (.025) Width H-DAC 64 High Density AutomotiveConnectors, Dual Row, Female Harness Assembly, 16 Circuits, Polarization Option 2Black,

File Size 479.64K  /  4 Page

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Amphenol Communications Solutions

Part No. 77313-801-16LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 16 Positions
Tech specs    

Official Product Page

    0307001169 30700-1169

Molex Electronics Ltd.
Part No. 0307001169 30700-1169
Description 2.54mm (.100) Pitch, 0.64mm (.025) Width H-DAC 64 High Density AutomotiveConnectors, Dual Row, Female Harness Assembly, 16 Circuits, Polarization Option 3Natural

File Size 479.63K  /  4 Page

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Amphenol Communications Solutions

Part No. 95293-401-16LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Single Row,16 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0705430116

Molex Electronics Ltd.
Part No. 0705430116
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 12Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 10116951-4030LF
Description CXP Passive Copper Cable Assemblies, Passive, 10Gb/s, 26 AWG, 3.0m, non-halogen free
Tech specs    

Official Product Page

    0901430116 90143-0116

Molex Electronics Ltd.
Part No. 0901430116 90143-0116
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 4 Polarizing Buttons, 16 Circuits
2.54mm (.100) Pitch C-Grid III垄芒 Modular Crimp Housing, Dual Row, 4 Polarizing Buttons, 16 Circuits

File Size 250.45K  /  2 Page

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Amphenol Communications Solutions

Part No. 10116951-2010HLF
Description CXP Passive Copper Cable Assemblies, Passive, 10Gb/s, 30 AWG, 1.0m, Halogen free
Tech specs    

Official Product Page

    0705630116 70563-0116

Molex Electronics Ltd.
Part No. 0705630116 70563-0116
Description 2.54mm (.100) Pitch SL?/a> Header, Single Row, Vertical, .180 Pocket, Shrouded, 12Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 214.21K  /  4 Page

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Amphenol Communications Solutions

Part No. 87901-164HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 64 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    0877910116

Molex Electronics Ltd.
Part No. 0877910116
Description 2.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Receptacle, Surface Mount, 16 Circuits, Gold (Au) Selective Plating, Tray Packaging, Lead-free

File Size 129.21K  /  3 Page

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Amphenol Communications Solutions

Part No. 10131930-116ULF
Description Minitek®, Board to Board, Receptacle, Through Mount, Single row, 16 Positions, 2mm (0.079inch), horizontal.
Tech specs    

Official Product Page

For 71764-0116 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

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