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  85013-0062 Datasheet PDF File

For 85013-0062 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

    Toshiba
Part No. TLP2631 E006291
Description ISOLATED LINE RECEIVER
From old datasheet system

File Size 361.83K  /  7 Page

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Amphenol Communications Solutions

Part No. 95278-501-38LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Toshiba
Part No. TLP2601 E006289
Description ISOLATED LINE RECEIVER
From old datasheet system

File Size 406.38K  /  8 Page

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Amphenol Communications Solutions

Part No. 95278-501-30LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 30 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    Toshiba
Part No. TLP168J E006275
Description From old datasheet system

File Size 242.26K  /  4 Page

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Amphenol Communications Solutions

Part No. 95278-501-34LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    Toshiba
Part No. TLP1034 E006229
Description From old datasheet system

File Size 369.09K  /  7 Page

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Amphenol Communications Solutions

Part No. 95278-501-36LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 36 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    TLP160 TLP160G E006270

TOSHIBA[Toshiba Semiconductor]
Part No. TLP160 TLP160G E006270
Description From old datasheet system
PHOTOCOUPLER GAAS IRED & PHOTO TRIAC

File Size 255.70K  /  5 Page

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Amphenol Communications Solutions

Part No. 95278-501-32LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 32 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    Toshiba
Part No. TLP2630 E006290
Description From old datasheet system

File Size 342.47K  /  7 Page

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Amphenol Communications Solutions

Part No. 54112-110062000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Toshiba
Part No. TLP1025 E006227
Description From old datasheet system

File Size 338.83K  /  7 Page

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Amphenol Communications Solutions

Part No. 89006-2137LF
Description Metral® Board Connectors, Backplane Connectors 5 Row Signal Header, Straight, 1 Mod, Press Fit.
Tech specs    

Official Product Page

    Toshiba
Part No. TLP141G E006269
Description From old datasheet system

File Size 267.14K  /  5 Page

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Amphenol Communications Solutions

Part No. 89006-2135LF
Description Metral® Board Connectors, Backplane Connectors 5 Row Signal Header, Straight, 1 Mod, Press Fit.
Tech specs    

Official Product Page

    Toshiba
Part No. TLP115A E006237
Description From old datasheet system

File Size 327.85K  /  7 Page

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Amphenol Communications Solutions

Part No. 10127720-062LF
Description Minitek® Pwr 3.0, Dual Row, Right Angle Through Hole Header, 6 Positions, Gold Flash plating, Non GW Compatible LCP, With Pegs, Tray Packing.
Tech specs    

Official Product Page

    Toshiba
Part No. TLP112A E006231
Description From old datasheet system

File Size 277.19K  /  6 Page

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Amphenol Communications Solutions

Part No. 89006-290LF
Description Metral® Board Connectors, Backplane Connectors 5 Row Signal Header, Straight, 1 Mod, Press Fit.
Tech specs    

Official Product Page

For 85013-0062 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

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