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Amphenol Communications Solutions |
| Part No. |
20021611-00040T4LF
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| Description |
1.27mm (0.05in.) pitch, Header with eject latch, 40 contacts
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
20021621-00026T1LF
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| Description |
1.27mm (0.05in.) pitch, Header with eject latch, 26 contacts
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
20021611-00006T8LF
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| Description |
1.27mm (0.05in.) pitch, Header with eject latch, 6 contacts
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0877580816 87758-0816
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid垄芒 Header, Through Hole, Vertical, 8 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
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| File Size |
170.91K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
75844-802-16LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0877580817 87758-0817
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079") Pitch Milli-Grid垄芒 Header, Through Hole, Vertical, 8 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
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| File Size |
170.96K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
20021611-00050T4LF
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| Description |
1.27mm (0.05in.) pitch, Header with eject latch, 50 contacts
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
20021612-00034T4LF
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| Description |
1.27mm (0.05in.) pitch, Header with eject latch, 34 contacts
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0877583650 87758-3650
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 36 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 36 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
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| File Size |
135.77K /
4 Page |
View
it Online |
Download Datasheet |
| |
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Amphenol Communications Solutions |
| Part No. |
20021621-00034T4LF
|
| Description |
1.27mm (0.05in.) pitch, Header with eject latch, 34 contacts
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87758-5017 0877585017
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid?Header, Through Hole, Vertical, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
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| File Size |
170.76K /
4 Page |
View
it Online |
Download Datasheet |
| |
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|
Amphenol Communications Solutions |
| Part No. |
98401-802-16LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
20021611-00026T4LF
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| Description |
1.27mm (0.05in.) pitch, Header with eject latch, 26 contacts
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
20021621-00012D4LF
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| Description |
1.27mm (0.05in.) pitch, Header with eject latch, 12 contacts
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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