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Texas Instruments |
Part No. |
REG104FA-3.3/500
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Description |
1A, Low-Noise, Low Dropout Regulator 5-DDPAK/TO-263
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Tech specs |
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Official Product Page
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![0901303208 90130-3208](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
0901303208 90130-3208
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Description |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 8 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 8 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating
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File Size |
168.45K /
4 Page |
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it Online |
Download Datasheet
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Texas Instruments |
Part No. |
REG1117F-3.3/500
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Description |
1A Low Dropout Positive Regulator 3-DDPAK/TO-263 0 to 125
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68690-130HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
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Tech specs |
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Official Product Page
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![0901301126 90130-1126](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
0901301126 90130-1126
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Description |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 26 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni) 2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 26 Circuits, Black, 3楼矛m (118楼矛) Tin (Sn) over Nickel (Ni)
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File Size |
586.04K /
7 Page |
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it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
92090-130LF
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Description |
Minitek® 2.00mm, Board to Board, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, Top Entry, 30 Positions, 2.00mm (0.079in) Pitch..
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Tech specs |
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Official Product Page
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![0901301128 90130-1128](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
0901301128 90130-1128
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Description |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 28 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni) 2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 28 Circuits, Black, 3楼矛m (118楼矛) Tin (Sn) over Nickel (Ni)
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File Size |
585.88K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
10065490-130TRLF
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Description |
Minitek® 2.00mm, Board To Board, Receptacle, Vertical, Surface Mount, Double Row, 30 Positions, 2.00mm (0.079in) Pitch.
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Tech specs |
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Official Product Page
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![90130-1212 0901301212](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
90130-1212 0901301212
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Description |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 12 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 12 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
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File Size |
586.12K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
78290-130HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
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Tech specs |
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Official Product Page
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![90130-3320 0901303320](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
90130-3320 0901303320
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Description |
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 20 Circuits, Black 0.76楼矛m (30楼矛) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 20 Circuits, Black 0.76μm (30μ) Gold (Au) Selective Plating
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File Size |
168.61K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
L17H2990130
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Description |
Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 26/26 (Socket/Socket), Flash Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 4*Arrowhead Boardlock
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Tech specs |
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Official Product Page
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![90130-1250 0901301250](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
90130-1250 0901301250
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Description |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 50 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 50 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
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File Size |
586.12K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
69190-130HLF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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![90130-1218 0901301218](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
90130-1218 0901301218
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Description |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 18 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 18 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
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File Size |
586.12K /
7 Page |
View
it Online |
Download Datasheet
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Bom2Buy.com
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Price and Availability
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