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Advanced Micro Devices, Inc.
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| Part No. |
MOBILEAMD-K6-2
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| Description |
32 Bit Microprocessor With 64-Kbyte Level-one Cache and Advanced RISC86 Superscalar Microarchitecture(32位微处理器带64K字节高速缓存和高级的RISC86超标量微体系结构)
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| File Size |
2,126.28K /
136 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10127815-14LF
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| Description |
Minitek® Pwr 4.2, Dual Row, Receptacle Housing, 14 Positions, Natural Color, GW Compatible Nylon66.
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| Tech specs |
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Official Product Page
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Advanced Micro Devices, Inc.
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| Part No. |
MOBILEAMD-K6
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| Description |
32 Bit Microprocessor With 64-K Byte Level-one Cache and Advanced RISC86 Superscalar Microarchitecture(32位微处理器带64K字节高速缓存和高级的RISC86超标量微体系结构)
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| File Size |
1,693.86K /
108 Page |
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it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
108-1511-201
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| Description |
Paladin® 112Gb/s Backplane Connector, 5-Pair, Guide Module, Ground Contact, No Key.
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Official Product Page
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Advanced Micro Devices, Inc.
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| Part No. |
AMDATHLON
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| Description |
32-Bit Microprocessor with 3D Multimedia Performance and Digital Video(32位微处理器带3D多媒体性能和数字视
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| File Size |
1,152.16K /
106 Page |
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it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77311-815-11LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 11 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
108-1511-200
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| Description |
Paladin® 112Gb/s Backplane Connector, 5-Pair, Guide Module, No Key.
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| Tech specs |
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Official Product Page
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OSRAM GmbH
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| Part No. |
AMDP-67205V-35 AM3P-67205L-35 AM3P-67205V-35 AMDP-67205L-35 AM4J-67205L-25 AM1I-67205L-25 AMS1-67205L-25
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| Description |
8K X 9 OTHER FIFO, 35 ns, CDFP28
8K X 9 OTHER FIFO, 35 ns, PDIP28
8K X 9 OTHER FIFO, 25 ns, CQCC32
8K X 9 OTHER FIFO, 25 ns, CDIP28
8K X 9 OTHER FIFO, 25 ns, PQCC32
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| File Size |
487.08K /
18 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
59112-T38-15-135LF
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| Description |
Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 30 Positions.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10127815-16LF
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| Description |
Minitek® Pwr 4.2, Dual Row, Receptacle Housing, 16 Positions, Natural Color, GW Compatible Nylon66.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
71918-151LF
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| Description |
Quickie Eject Latch Shrouded Header, Through Hole, Vertical, Double Row, Polarized, 50 Positions, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
108-1511-100
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| Description |
Paladin® 112Gb/s Backplane Connector, 5-Pair, Guide Module, With Post, No Key.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
108-1511-101
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| Description |
Paladin® 112Gb/s Backplane Connector, 5-Pair, Guide Module, With Post, Ground Contact, No Key.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10127815-12LF
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| Description |
Minitek® Pwr 4.2, Dual Row, Receptacle Housing, 12 Positions, Natural Color, GW Compatible Nylon66.
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| Tech specs |
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Official Product Page
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Price and Availability
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