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Fairchild Semiconductor Corporation FAIRCHILD[Fairchild Semiconductor]
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Part No. |
RMPA0963
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OCR Text |
...stand 125C baking temperature * assemble the dry-baked devices within 7 days of removal from the oven. * During the 7-day period, the devices must be stored in an environment of less than 60% relative humidity and a maximum temperature of 3... |
Description |
Cellular CDMA, CDMA2000-1X and WCDMA Power Amplifier Module From old datasheet system
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File Size |
117.92K /
7 Page |
View
it Online |
Download Datasheet
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FAIRCHILD[Fairchild Semiconductor]
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Part No. |
RMPA5255
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OCR Text |
...procedures prior to assembly. * assemble the devices within 7 days of removal from the dry pack. * During the 7-day period, the devices must be stored in an environment of less than 60% relative humidity and a maximum temperature of 30C * I... |
Description |
From old datasheet system 4.9-5.9 GHz WLAN Linear Power Amplifier Module
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File Size |
779.24K /
7 Page |
View
it Online |
Download Datasheet
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Price and Availability
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