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6Z309 34FBXXX 4ADTR D15XBS6 DM74AL ACT8840 UCA6493N KA558D2
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    NNCD5.6MG NNCD6.2MG NNCD6.8MG NNCD6.2MG-T1 NNCD6.2MG-T2 NNCD5.6MG-T2 NNCD6.8MG-T2 NNCD5.6MG-T1 NNCD6.8MG-T1

NEC[NEC]
NEC Corp.
NEC, Corp.
Part No. NNCD5.6MG NNCD6.2MG NNCD6.8MG NNCD6.2MG-T1 NNCD6.2MG-T2 NNCD5.6MG-T2 NNCD6.8MG-T2 NNCD5.6MG-T1 NNCD6.8MG-T1
OCR Text ...duct can cope with high density assembling. 2.9 0.2 0.95 PACKAGE DIMENSIONS (in millimeters) 2.8 0.2 0.32 -0.06 +0.1 1.5 0.65 -0.15 +0.1 as USB. 1.9 1 5 FEATURES * Based on the electrostatic discharge immunity...
Description ESD noise clipping diode 5pin SC-74A Low capacitance,Hi ESD type
LOW CAPACITANCE HIGH ESD TYPE ELECTROSTATIC DISCHARGE NOISE CLIPPING DIODES QUARTO TYPE: COMMON ANODE 5-PIN MINI MOLD 低电容高ESD静电放电噪音型裁剪二极管季刊类型:共阳极5针迷你模

File Size 31.34K  /  4 Page

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    NNCD5.6LH NNCD6.2LH NNCD6.8LH

NEC, Corp.
NEC Corp.
Part No. NNCD5.6LH NNCD6.2LH NNCD6.8LH
OCR Text ...can cope with more high density assembling. 0.65 With four elements mounted in the 5-pin super mini mold 2 3 4 0.15 -0.05 FEATURES 4-2), the product assures the minimum endurance of 8 kV. * Capacitance is small with 10 p...
Description 2 W, UNIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE
LOW CAPACITANCE TYPE ELECTROSTATIC DISCHARGE NOISE CLIPPING DIODES QUARTO TYPE: COMMON ANODE 5-PIN SUPER SMALL MINI MOLD 低电容式静电放电噪声裁剪二极管季刊类型:共阳引脚超小微型模具

File Size 45.61K  /  8 Page

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    NNCD5.6LG NNCD6.2LG NNCD6.8LG

NEC, Corp.
NEC Corp.
Part No. NNCD5.6LG NNCD6.2LG NNCD6.8LG
OCR Text ...duct can cope with high density assembling. 0.95 With four elements mounted in the 5Pin Mini Mold Package, 2 3 4 0.16 -0.06 FEATURES 4-2), the product assures the minimum endurance of 8 kV. * Capacitance is small with 10...
Description LOW CAPACITANCE TYPE ELECTROSTATIC DISCHARGE NOISE CLIPPING DIODES QUARTO TYPE: COMMON ANODE 5-PIN MINI MOLD 低电容式静电放电噪声裁剪二极管季刊类型:共阳针迷你模

File Size 45.47K  /  8 Page

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    Kitronix
Part No. T200QFE-V44-F
OCR Text ...LCD modules. Tools required for assembling, such as soldering irons, must be properly grounded. To reduce the amount of static electricity generated, do not conduct assembling and other work under dry conditions. The LCD module is coated wi...
Description Standard LCD Module

File Size 998.36K  /  23 Page

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    CMLMICRO[CML Microcircuits]
Part No. EV8000
OCR Text ...LAB software is required for re-assembling the source code. These tools are available from Arizona Microchip Technology. 1.2.1.8 A UV-eraser to remove the pre-programmed PIC C firmware. 1.2.2 Handling Precautions Like most evaluation ...
Description CML Semiconductor Products

File Size 616.86K  /  38 Page

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    ONSEMI[ON Semiconductor]
Part No. ECLTSSOP20EVB
OCR Text ... device. See Figure 5) After assembling the evaluation board, it is recommended to perform continuity checks on all soldered areas before commencing with the evaluation process. Time Domain Reflectometry (TDR) is another highly recommend...
Description Evaluation Board Manual for High Frequency TSSOP 20

File Size 185.06K  /  18 Page

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    ONSEMI[ON Semiconductor]
Part No. ECLSOIC8EVB NB6L16D MC100EL01D MC100EL04D MC100EL05D MC100EL07D MC100EL11D MC100EL12D MC100EL16D MC100EL31D MC100EL32D MC100EL33D MC100EL35D MC100EL51D MC100EL52D MC100EL58D MC100EL89D MC100ELT20D MC100ELT21D MC100ELT22D MC100ELT23D MC100ELT26D MC100ELT28D MC100EP01D MC100EP05D MC100EP08D MC100EP11D MC100EP16FD MC100EP16TD MC100EP16VAD MC100EP16VBD MC100EP16VCD MC100EP16VSD MC100EP16VTD MC100EP31D MC100EP32D MC100EP33D MC100EP35D MC100EP51D MC100EP52D MC100EP58D MC100EP89D MC100EPT20D MC100EPT21D MC100EPT22D MC100EPT23D MC100EPT26D MC100LVEL01D MC100LVEL05D MC100LVEL11D MC100LVEL12D MC100LVEL16D MC100LVEL31D MC100LVEL32D MC100LVEL33D MC100LVEL51D MC100LVEL58D MC100LVELT22D MC100LVELT23D MC100LVEP11D MC100LVEP16D MC10EL01D MC10EL04D MC10EL05D MC10EL07D MC10EL11D MC10EL12D MC10EL16D MC10EL31D MC10EL32D MC10EL33D MC10EL35D MC10EL51D MC10EL52D MC10EL58D MC10EL89D MC10ELT20D MC10ELT21D MC10ELT22D MC10ELT26D MC10ELT28D MC10EP01D MC10EP05D MC10EP08D MC10EP11D MC10EP16D MC10EP16TD MC10EP31D MC10EP32D MC10EP33D MC10EP35D MC10EP51D MC10EP52D MC10EP58D MC10EPT20D NB6L11D MC100EL32DTR2 MC100EL07DR2 MC100EL32DR2
OCR Text ...ng the Assembled Board After assembling the evaluation board, it is recommended to perform continuity checks on all soldered areas before commencing with the evaluation process. Time Domain Reflectometry (TDR) is another highly recommend...
Description 3.3V / 5V ECL JK Flip Flop
5V ECL 2-Input XOR/XNOR
5V ECL Divide by 2 Divider
Evaluation Board Manual for High Frequency SOIC 8

File Size 201.45K  /  20 Page

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    EPCOS[EPCOS]
Part No. B67385P0000X187I B67385 B67385G0000X187 B67385G0000X187U B67385P B67385P0000X187
OCR Text ... mechanical requirements during assembling and for a growing number of applications. Since ferrites are ceramic materials one has to be aware of the special behavior under mechanical load. As valid for any ceramic material, ferrite cores ar...
Description Ferrites and accessories UU 126/182/20, UI 126/119/20 Core set

File Size 49.80K  /  4 Page

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    EPCOS[EPCOS]
Part No. B67374G0000X187 B67374 B67374G0000X127
OCR Text ... mechanical requirements during assembling and for a growing number of applications. Since ferrites are ceramic materials one has to be aware of the special behavior under mechanical load. As valid for any ceramic material, ferrite cores ar...
Description Ferrites and accessories U 141/78/30 Core

File Size 46.37K  /  4 Page

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    EUDYNA[Eudyna Devices Inc]
Part No. F0513005L
OCR Text ...g to enhance the flexibility of assembling design. It was originally developed by SEI to improve RF performance and heat radiation. Compared with the LCC, the ground potential is stabler at microwave frequency range and the thermal resistiv...
Description 3 Gb/s NRZ Data Rate Laser Diode Driver

File Size 445.01K  /  13 Page

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