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Kitronix
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Part No. |
T200QFE-V44-F
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OCR Text |
...LCD modules. Tools required for assembling, such as soldering irons, must be properly grounded. To reduce the amount of static electricity generated, do not conduct assembling and other work under dry conditions. The LCD module is coated wi... |
Description |
Standard LCD Module
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File Size |
998.36K /
23 Page |
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it Online |
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CMLMICRO[CML Microcircuits]
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Part No. |
EV8000
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OCR Text |
...LAB software is required for re-assembling the source code. These tools are available from Arizona Microchip Technology. 1.2.1.8 A UV-eraser to remove the pre-programmed PIC C firmware.
1.2.2
Handling Precautions Like most evaluation ... |
Description |
CML Semiconductor Products
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File Size |
616.86K /
38 Page |
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it Online |
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ONSEMI[ON Semiconductor]
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Part No. |
ECLTSSOP20EVB
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OCR Text |
... device. See Figure 5)
After assembling the evaluation board, it is recommended to perform continuity checks on all soldered areas before commencing with the evaluation process. Time Domain Reflectometry (TDR) is another highly recommend... |
Description |
Evaluation Board Manual for High Frequency TSSOP 20
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File Size |
185.06K /
18 Page |
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it Online |
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EPCOS[EPCOS]
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Part No. |
B67374G0000X187 B67374 B67374G0000X127
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OCR Text |
... mechanical requirements during assembling and for a growing number of applications. Since ferrites are ceramic materials one has to be aware of the special behavior under mechanical load. As valid for any ceramic material, ferrite cores ar... |
Description |
Ferrites and accessories U 141/78/30 Core
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File Size |
46.37K /
4 Page |
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EUDYNA[Eudyna Devices Inc]
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Part No. |
F0513005L
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OCR Text |
...g to enhance the flexibility of assembling design. It was originally developed by SEI to improve RF performance and heat radiation. Compared with the LCC, the ground potential is stabler at microwave frequency range and the thermal resistiv... |
Description |
3 Gb/s NRZ Data Rate Laser Diode Driver
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File Size |
445.01K /
13 Page |
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it Online |
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Price and Availability
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