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M62354FP 6BA8A FE8022 MAX497 DG411 03M1610X CXA3556N DA05C
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  B3D-4112 Datasheet PDF File

For B3D-4112 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

    HGTG20N60B3D G20N60B3 G20N60B3D

FAIRCHILD[Fairchild Semiconductor]
Fairchild Semiconductor Corporation
Part No. HGTG20N60B3D G20N60B3 G20N60B3D
Description 40A / 600V / UFS Series N-Channel IGBT with Anti-Parallel Hyperfast Diode
40A, 600V, UFS Series N-Channel IGBT with Anti-Parallel Hyperfast Diode
3.3V 36-mc CPLD

File Size 176.68K  /  7 Page

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Murata Manufacturing Co Ltd

Part No. MHM411-21
Description Ionizer Module, 100-120VAC-input, Negative Ion
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    HARRIS SEMICONDUCTOR
Part No. HGTG12N60B3D
Description 27 A, 600 V, N-CHANNEL IGBT, TO-247

File Size 304.60K  /  11 Page

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Amphenol Communications Solutions

Part No. 54112-411281350LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 28 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Powerex
Part No. T82F T82F1275B3DN
Description Silicon-Controlled Rectifier

File Size 501.54K  /  2 Page

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Amphenol Communications Solutions

Part No. 54112-411262200LF
Description BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Double Row, 26 Positions
Tech specs    

Official Product Page

    Intersil, Corp.
Part No. HGTG30N60B3D
Description 60A, 600V, UFS Series N-Channel IGBT with Anti-Parallel Hyperfast Diode(60A, 600V, UFS系列 带超快二极管N沟道绝缘栅双极型晶体 60 A, 600 V, N-CHANNEL IGBT, TO-247

File Size 117.96K  /  8 Page

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Amphenol Communications Solutions

Part No. 54112-107400900LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Cystech Electonics Corp...
Part No. MTB3D0N03BJ3-0-T3-G
Description N-Channel Logic Level Enhancement Mode Power MOSFET

File Size 386.18K  /  9 Page

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Amphenol Communications Solutions

Part No. 54112-803080900LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    KEC Holdings
KEC[KEC(Korea Electronics)]
Part No. KMB3D5PS30QA
Description SBD and P-Ch Trench MOSFET SBD智能交通和P -沟道MOSFET

File Size 464.70K  /  5 Page

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Amphenol Communications Solutions

Part No. 54112-409241000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 24 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    MTB3D0N03BH8-0-T6-G

Cystech Electonics Corp.
Part No. MTB3D0N03BH8-0-T6-G
Description N-Channel Logic Level Enhancement Mode Power MOSFET

File Size 408.17K  /  9 Page

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Amphenol Communications Solutions

Part No. 54112-110102000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0010441123 10-44-1123 2599-12BG A-2599-12BG

Molex Electronics Ltd.
Part No. 0010441123 10-44-1123 2599-12BG A-2599-12BG
Description 5.08mm (.200") Pitch KK庐 Header, Vertical, with Polarizing Backwall, 12 Circuits, Gold (Au) Plating
5.08mm (.200) Pitch KK? Header, Vertical, with Polarizing Backwall, 12 Circuits, Gold (Au) Plating

File Size 2,637.77K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-110062000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    M22-2410546 M22-2411246 M22-2410942

Harwin PLC
Part No. M22-2410546 M22-2411246 M22-2410942
Description 2.00mm Pitch DIL Horizontal PC Tail Pin Header, stable moulding, tin, 5 5-way 10 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
2.00mm Pitch DIL Horizontal PC Tail Pin Header, stable moulding, tin, 12 12-way 24 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
2.00mm Pitch DIL Horizontal PC Tail Pin Header, stable moulding, selective gold tin, 9 9-way 18 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER

File Size 584.57K  /  1 Page

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Amphenol Communications Solutions

Part No. 54112-107641100LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 64 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0010441121 10-44-1121 2599-12AG A-2599-12AG

Molex Electronics Ltd.
Part No. 0010441121 10-44-1121 2599-12AG A-2599-12AG
Description 5.08mm (.200") Pitch KK庐 Header, Vertical, with Polarizing Backwall, 12 Circuits, Gold (Au) Plating
5.08mm (.200) Pitch KK? Header, Vertical, with Polarizing Backwall, 12 Circuits, Gold (Au) Plating

File Size 2,122.78K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-112400900LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For B3D-4112 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

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