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				MIMIX BROADBAND INC
Part No.	CF003-03-000X
OCR Text	...ers; time: 1 min or less. wire bonding: wire size: 0.7 to 1.0 mil in diameter (pre- stressed); thermocompression bonding is preferred over thermosonic bonding. for thermocompression bonding: stage temperature: 250 oc ; bond tip temperat...
Description	K BAND, GaAs, N-CHANNEL, RF POWER, HEMFET
File Size	859.38K / 4 Page	View it Online	Download Datasheet

				Anadigics Inc ANADIGICS[ANADIGICS, Inc]
Part No.	ATA00501D1C ATA00501
OCR Text	... um 4 5 6 Figure 2: bonding Pad Layout (Die Only) P IN 1 2 3 4 5 6 D E S C R IP TION NC GND IIN C BY GND C AGC P IN 7 8 9 10 11 12 Figure 3: Pin Layout Table 2:ATA00501S2C Pin Description D E S C R IP TION V OUT GND NC V...
Description	The ANADIGICS ATA00501 is a 5V low noise transimpedance amplifier with AGC designed to be used in OC-1 fiber optic links. AGC TRANSIMPEDANCE AMPLIFIER Transimpedance Amplifiers (TIAs)
File Size	220.21K / 8 Page	View it Online	Download Datasheet

				Holtek Semiconductor In... HOLTEK[Holtek Semiconductor Inc] Holtek Semiconductor Inc.
Part No.	HT7500
OCR Text	... (0.2F) Resolution: 0.1C (0.1F) bonding option for Centigrade/Fahrenheit measurement * * * * * Alarm warning for fever Highest temperature hold Auto power off after 8 min 40 sec One-key input switch for ON/OFF Displays last time measu...
Description	Clinical Thermometer(体温
File Size	89.29K / 8 Page	View it Online	Download Datasheet

For bonding Found Datasheets File :: 7147 Search Time::1.032ms
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