CGA-6618 pdf Datasheet P15 Part Num --- IC-ON-LINE


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CGA-6618 Datasheet PDF File

For CGA-6618 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |

					TDK Electronics
Part No.	CGA4J3X7R1C475M125AB
Description	Multilayer Ceramic Chip Capacitors
File Size	130.63K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	131-6618-21D
Description	Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right Polarized, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs				Official Product Page

HUA FENG CIRCUIT

					TDK Electronics
Part No.	CGA4J3X7R1C475K125AE-17
Description	Multilayer Ceramic Chip Capacitors
File Size	229.84K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	131-6618-21H
Description	Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right Polarized, Backplane Module, 2.25mm Wipe, APP.
Tech specs				Official Product Page

					TDK Electronics
Part No.	CGA4J3X7R1C335M125AD
Description	Multilayer Ceramic Chip Capacitors
File Size	130.55K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10156618-0200LF
Description	Minitek® Board-In, Wire to Board Connectors, Vertical housing 2.50mm 2 positions
Tech specs				Official Product Page

					TDK Electronics
Part No.	CGA4J3X7R1C335M125AB-17
Description	Multilayer Ceramic Chip Capacitors
File Size	231.07K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10156618-1200LF
Description	Minitek® Board-In, Wire to Board Connectors, Vertical housing 2.50mm 12 positions
Tech specs				Official Product Page

					TDK Electronics
Part No.	CGA4J3X7R1C335M125AB
Description	Multilayer Ceramic Chip Capacitors
File Size	130.61K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10156618-1100LF
Description	Minitek® Board-In, Wire to Board Connectors, Vertical housing 2.50mm 11 positions
Tech specs				Official Product Page

					TDK Electronics
Part No.	CGA4J3X7R1C225M125AB
Description	Multilayer Ceramic Chip Capacitors
File Size	130.92K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10156618-0400LF
Description	Minitek® Board-In, Wire to Board Connectors, Vertical housing 2.50mm 4 positions
Tech specs				Official Product Page

					TDK Electronics
Part No.	CGA4J3X7R1C225K125AB-17
Description	Multilayer Ceramic Chip Capacitors
File Size	231.83K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10156618-1400LF
Description	Minitek® Board-In, Wire to Board Connectors, Vertical housing 2.50mm 14 positions
Tech specs				Official Product Page

					TDK Electronics
Part No.	CGA4J3X7R1C155M125AB-17
Description	Multilayer Ceramic Chip Capacitors
File Size	233.48K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	DWRT200PM16618
Description	COOLPOWER MEZZANINE
Tech specs				Official Product Page

					TDK Electronics
Part No.	CGA4J3X7R1C155M125AB
Description	Multilayer Ceramic Chip Capacitors
File Size	130.68K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	131-6618-11D
Description	Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs				Official Product Page

					TDK Electronics
Part No.	CGA4J3X7R1C155K125AB-17
Description	Multilayer Ceramic Chip Capacitors
File Size	233.09K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	131-6618-11H
Description	Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs				Official Product Page

For CGA-6618 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |

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