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  HBCR-1811 Datasheet PDF File

For HBCR-1811 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

    MICRF218 MICRF218AYQS MICRF21811

Micrel Semiconductor
Part No. MICRF218 MICRF218AYQS MICRF21811
Description 3.3V, 315/433MHz Wide-IF Bandwidth ASK Receiver
File Size 834.54K  /  23 Page

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Amphenol Communications Solutions
Part No. 131-8118-11D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    PD412411 PD4111 PD412211 PD411811 PD412011

POWEREX[Powerex Power Semiconductors]
Part No. PD412411 PD4111 PD412211 PD411811 PD412011
Description POW-R-BLOK Dual Diode Isolated Module (1100 Amperes / Up to 2400 Volts)
File Size 87.53K  /  5 Page

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Amphenol Communications Solutions
Part No. 131-8118-11H
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs 　 　

Official Product Page

    iMP
Part No. IMP1815 IMP1817 IMP1816 IMP1812 IMP1811 IMP1810 IMP1233M IMP1233D IMP18XX
Description Low Poower, 5V µP Reset, Power Management
Low Poower, 3.3V µP Reset, Power Management
Lo Low P w Po ow wer er, 5V , 5V µ µP P Reset
From old datasheet system
File Size 1,285.76K  /  36 Page

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Amphenol Communications Solutions
Part No. 10131318-18111G0LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 18 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs 　 　

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    IMP1233D IMP1810 IMP1811 IMP1812 IMP1815 IMP1816 IMP1817 IMP1233M IMP1233DZ-10_T IMP1233DZ-15_T IMP1233DZ-5_T IMP1233DZ-

IMP INC.
IMP Inc
IMP[IMP, Inc]
IMP[IMP Inc]
Part No. IMP1233D IMP1810 IMP1811 IMP1812 IMP1815 IMP1816 IMP1817 IMP1233M IMP1233DZ-10_T IMP1233DZ-15_T IMP1233DZ-5_T IMP1233DZ-5/T IMP1233DZ-15/T IMP1233DZ-10/T IMP1233DZ-10T IMP1233DZ-15T
Description 4.125V power reset
RELAY 024VDC 01A DPDT-XX FORM:2C UC
Bi-Lobe Standard Metal Shell Nano Offset Connector
Low Power 5V/3.0V P Reset
Low Power/ 5V/ P Reset
Low Power, 5V, 楼矛P Reset
Low Power 5V P Reset
Low Power, 5V, P Reset
Low Power, 5V, μP Reset
4.375V power reset
File Size 116.91K  /  6 Page

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Amphenol Communications Solutions
Part No. 68418-112HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 12 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 10.16 mm (0.4 in.) Tail
Tech specs 　 　

Official Product Page

    IMP1810 IMP1811 IMP1812 IMP1815 IMP1816 IMP1817 IMP1232LPS-2

A1 PROs co., Ltd.
Part No. IMP1810 IMP1811 IMP1812 IMP1815 IMP1816 IMP1817 IMP1232LPS-2
Description Low Power,, 5V - Ressett- Acttiive LOW,, Open--Draiin Outtputt
5V 楼矛P Power Supplly Moniittor and Ressett Ciircuiitt
File Size 1,779.71K  /  36 Page

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Amphenol Communications Solutions
Part No. 77315-118-11LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 11 Positions 2.54 mm (0.100in) Pitch, Right Angle
Tech specs 　 　

Official Product Page

    K7P803611B K7P803611B-HC33 K7P803611B-HC30 K7P801811B K7P801811B-HC25 K7P801811B-HC27 K7P801811B-HC30 K7P801811B-HC33 K7

SAMSUNG[Samsung semiconductor]
Part No. K7P803611B K7P803611B-HC33 K7P803611B-HC30 K7P801811B K7P801811B-HC25 K7P801811B-HC27 K7P801811B-HC30 K7P801811B-HC33 K7P803611B-HC25 K7P803611B-HC27
Description 256Kx36 & 512Kx18 Synchronous Pipelined SRAM
File Size 247.30K  /  13 Page

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Amphenol Communications Solutions
Part No. 77315-418-11LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 11 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs 　 　

Official Product Page

    Samsung Electronic
Part No. K7P401811M-HC160 K7P403611M-HC200 K7P403611M
Description 128Kx36 & 256Kx18 Synchronous Pipelined SRAM Data Sheet
128K X 36 STANDARD SRAM, 2.5 ns, PBGA119 14 X 22 MM, 1.27 MM PITCH, BGA-119
256K X 18 STANDARD SRAM, 3 ns, PBGA119 14 X 22 MM, 1.27 MM PITCH, BGA-119
File Size 328.76K  /  13 Page

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Amphenol Communications Solutions
Part No. 131-4218-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

    W91810LN W91810ALN W91810AN W91810N W91811ALN W91811AN

Winbond
Part No. W91810LN W91810ALN W91810AN W91810N W91811ALN W91811AN
Description 23-MEMORY TONE/PULSE DIALER WITH HANDFREE/ LOCK AND HOLD FUNCTIONS
File Size 240.47K  /  26 Page

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Amphenol Communications Solutions
Part No. 131-5618-11D
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

    AIC1811CCV AIC1811ACV AIC1811BCV AIC1811

Analog Integrations Corporation
AIC[Analog Intergrations Corporation]
Part No. AIC1811CCV AIC1811ACV AIC1811BCV AIC1811
Description One-Cell Lithium-Ion Battery Protection IC
File Size 118.42K  /  8 Page

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Amphenol Communications Solutions
Part No. 131-7418-11D
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 8 Column, Right End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

    SOURIAU INC
Part No. 85106JC1811SW50
Description 11 CONTACT(S), ALUMINUM ALLOY, FEMALE, MIL SERIES CONNECTOR, SOLDER, PLUG
File Size 181.80K  /  1 Page

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Amphenol Communications Solutions
Part No. 131-3218-11H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Double End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs 　 　

Official Product Page

For HBCR-1811 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

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