HDMP-1636 pdf Datasheet P15 Part Num --- IC-ON-LINE


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HDMP-1636 Datasheet PDF File

For HDMP-1636 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |

					SAMSUNG[Samsung semiconductor]
Part No.	K7N163601M K7N161801M
Description	512Kx36 & 1Mx18-Bit Pipelined NtRAM TM
File Size	314.12K / 20 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	61082-163602LF
Description	BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 160 Positions.
Tech specs				Official Product Page

HUA FENG CIRCUIT

					SAMSUNG SEMICONDUCTOR CO. LTD.
Part No.	K7N161801M K7N163601M
Description	512Kx36 & 1Mx18-Bit Pipelined NtRAM TM
File Size	317.40K / 20 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	75168-316-36LF
Description	BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					SAMSUNG SEMICONDUCTOR CO. LTD. SAMSUNG[Samsung semiconductor] Samsung Electronic
Part No.	K7J163682B K7J161882B
Description	512Kx36 & 1Mx18 DDR II SIO b2 SRAM
File Size	371.63K / 17 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	61083-163622LF
Description	BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs				Official Product Page

					ANALOG DEVICES INC
Part No.	ADIS16360BMLZ
Description	SPECIALTY ANALOG CIRCUIT, XMA24
File Size	341.61K / 20 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	61082-163600LF
Description	0.8MM B TO B REC ASSY
Tech specs				Official Product Page

					ANALOG DEVICES INC
Part No.	ADIS16367BMLZ
Description	SPECIALTY ANALOG CIRCUIT, XMA24
File Size	359.93K / 20 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	61083-163600LF
Description	BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs				Official Product Page


Part No.	K7Q163684A-FC16 K7Q161884A-FC16
Description
File Size	509.59K / 17 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	61083-163602LF
Description	BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs				Official Product Page

					TOSHIBA
Part No.	TC55V16366FFI-133 TC55V16366FFI-150
Description	524,288-WORD BY 36-BIT SYNCHRONOUS PIPELINED BURST STATIC RAM
File Size	1,143.07K / 19 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	75168-116-36LF
Description	BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					TOSHIBA
Part No.	TC55VD1636FFI-133 TC55VD1636FFI-150
Description	524,288-WORD BY 36-BIT SYNCHRONOUS NO-TURNAROUND STATIC RAM
File Size	892.46K / 20 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	RJMG163618101NR
Description	RJMG, Input output Connectors, 1x1,10/100 with LEDs
Tech specs				Official Product Page

					Samsung semiconductor
Part No.	K7Q161864B K7Q161864B-FC16 K7Q163664B K7Q163664B-FC16
Description	512Kx36 & 1Mx18 QDR TM b4 SRAM
File Size	341.45K / 17 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	61082-163622LF
Description	BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 160 Positions.
Tech specs				Official Product Page

					SAMSUNG SEMICONDUCTOR CO. LTD.
Part No.	K7Q163664B-FC16 K7Q161864B-FC16
Description	512Kx36 & 1Mx18 QDR TM b4 SRAM
File Size	347.73K / 17 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	UE86G16360033T
Description	XCede I/O, High Speed Input Output Connectors, 1X1 XCede IO COMBO.
Tech specs				Official Product Page

For HDMP-1636 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |

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