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				ICST[Integrated Circuit Systems]
Part No.	ICS9179B-01 ICS9179BF-01
OCR Text	...) Use a ground plane on the top layer of the PCB in all areas not used by traces. 2) Make all power traces and vias as wide as possible to lower inductance. Notes: 1 All clock outputs should have series terminating resistor. Not shown in...
Description	Low Skew Buffers
File Size	510.52K / 9 Page	View it Online	Download Datasheet

				IRF[International Rectifier]
Part No.	IR2101
OCR Text	...of Gate Oxide Connections First layer Second layer Contact Hole Dimension Insulation layer Passivation Method of Saw Method of Die Bond Wire Bond Leadframe Material Width Spacing Thickness Material Width Spacing Thickness Material Thi...
Description	HIGH AND LOW SIDE DRIVER
File Size	357.98K / 6 Page	View it Online	Download Datasheet

				International Rectifier
Part No.	IR2112
OCR Text	...of Gate Oxide Connections First layer Second layer Contact Hole Dimension Insulation layer Passivation Method of Saw Method of Die Bond Wire Bond Leadframe Material Width Spacing Thickness Material Width Spacing Thickness Material Thi...
Description	HIGH AND LOW SIDE DRIVER
File Size	379.67K / 14 Page	View it Online	Download Datasheet

				IRF[International Rectifier]
Part No.	IR2113
OCR Text	...of Gate Oxide Connections First layer Second layer Contact Hole Dimension Insulation layer Passivation Method of Saw Method of Die Bond Wire Bond Leadframe Material Width Spacing Thickness Material Width Spacing Thickness Material Thi...
Description	HIGH AND LOW SIDE DRIVER
File Size	388.64K / 14 Page	View it Online	Download Datasheet

				IRF[International Rectifier]
Part No.	IR2117
OCR Text	...of Gate Oxide Connections First layer Second layer Contact Hole Dimension Insulation layer Passivation Method of Saw Method of Die Bond Wire Bond Leadframe Material Width Spacing Thickness Material Width Spacing Thickness Material Thi...
Description	SINGLE CHANNEL DRIVER
File Size	219.94K / 7 Page	View it Online	Download Datasheet

				International Rectifier
Part No.	IR2127
OCR Text	...of Gate Oxide Connections First layer Second layer Contact Hole Dimension Insulation layer Passivation Method of Saw Method of Die Bond Wire Bond Leadframe Material Width Spacing Thickness Material Width Spacing Thickness Material Thi...
Description	CURRENT SENSING SINGLE CHANNEL DRIVER
File Size	187.77K / 6 Page	View it Online	Download Datasheet

				International Rectifier
Part No.	IR2153
OCR Text	...of Gate Oxide Connections First layer Second layer Contact Hole Dimension Insulation layer Passivation Method of Saw Method of Die Bond Wire Bond Leadframe Material Width Spacing Thickness Material Width Spacing Thickness Material Thi...
Description	SELF-OSCILLATING HALF-BRIDGE DRIVER
File Size	209.66K / 8 Page	View it Online	Download Datasheet

				AD[Analog Devices]
Part No.	IRF7233 ADN8830 SI7904DN FDW2520C FDR6674A FDR840P IRF7401 IRF7404 SI7401DN
OCR Text	...ed for a device soldered in a 4-layer circuit board for surface-mount packages. 883 (Human Body) Model . . . . . . . . . . . . . . . . . . . . . . 1.0 kV *Stresses above those listed under Absolute Maximum Ratings may cause permanent da...
Description	Thermoelectric Cooler Controller
File Size	368.92K / 24 Page	View it Online	Download Datasheet

				SANYO[Sanyo Semicon Device] Sanyo Electric Co.,Ltd.
Part No.	LE28F4001M LE28F4001R LE28F4001R-15 LE28F4001R-20 LE28F4001T LE28F4001M-15 LE28F4001T-15 LE28F4001M-20 LE28F4001T-20
OCR Text	...bricated in a highly reliable 2-layer polysilicon CMOS flash EEPROM process. * Read and write operation from a 5 V single-voltage power supply * Sector erase function: 256 bytes per sector * Fast access time: 150/200 ns * Low power -- Opera...
Description	4MEG (524288words x 8bit) flash memory 4 MEG (524288 words x 8 bits) Flash Memory
File Size	216.11K / 14 Page	View it Online	Download Datasheet

For layer Found Datasheets File :: 23033 Search Time::1.796ms
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