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  microwave millimeter Datasheet PDF File

For microwave millimeter Found Datasheets File :: 340    Search Time::1.75ms    
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    CSD-20H-0.9G

Merrimac Industries, Inc.
Part No. CSD-20H-0.9G
OCR Text ...re with superior performance at microwave and millimeter wave frequencies. The bonded multilayers can contain embedded semiconductors, MMICs, etched resistors, circuit patterns, and plated-through vias to form a SMD module that requires no ...
Description DIRECTIONAL COUPLER

File Size 145.49K  /  5 Page

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    XD1002-BD-EV1 XD1002-BD-000V XD1002-BD

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Mimix Broadband
Part No. XD1002-BD-EV1 XD1002-BD-000V XD1002-BD
OCR Text ... This device is well suited for microwave, millimeter-wave, wideband military, and fiber optic applications. Absolute Maximum Ratings Supply Voltage (Vd) Supply Current (Id) Gate Bias Voltage (Vg) Input Power (Pin) Storage Temperature (...
Description 0.05-50.0 GHz GaAs MMIC Distributed Amplifier

File Size 354.35K  /  6 Page

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    XD1001-BD-EV1 XD1001-BD-000V

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Mimix Broadband
Part No. XD1001-BD-EV1 XD1001-BD-000V
OCR Text ... This device is well suited for microwave, millimeter-wave, wideband military, and fiber optic applications. Absolute Maximum Ratings Supply Voltage (Vd) Supply Current (Id) Gate Bias Voltage (Vg) Input Power (Pin) Storage Temperature (...
Description 18.0-50.0 GHz GaAs MMIC Distributed Amplifier

File Size 255.52K  /  6 Page

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    TriQuint Semiconductor, Inc.
Part No. TGA1073A-SCC TGA1073A-SCC-15
OCR Text ...exhaust is a safety concern. microwave or radiant curing should not be used because of differential heating. coefficient of thermal expansion matching is critical. interconnect process assembly notes: thermosonic ball bonding is th...
Description 26 35 GHz Medium Power Amplifier

File Size 125.59K  /  7 Page

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    TriQuint Semiconductor, Inc.
Part No. TGA1073C-SCC TGA1073C-SCC-15
OCR Text ...exhaust is a safety concern. microwave or radiant curing should not be used because of differential heating. coefficient of thermal expansion matching is critical. interconnect process assembly notes: thermosonic ball bonding is th...
Description 36 40 GHz Power Amplifier

File Size 316.19K  /  6 Page

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    B1007-BD09

Mimix Broadband
Part No. B1007-BD09
OCR Text ...this device is well suited for microwave and millimeter-wave point-to-point radio, lmds, satcom and vsat applications. general description october 2009 - rev 10-oct-09 buffer amplifier measurements page 2 of 9 4.0-11.0 ghz gaas mmic bu...
Description 4.0-11.0 GHz GaAs MMIC

File Size 251.91K  /  9 Page

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    PDD-2Z-2.0G

Merrimac Industries, Inc.
Part No. PDD-2Z-2.0G
OCR Text ...re with superior performance at microwave and millimeter wave frequencies. The bonded layers can contain embedded semiconductors, MMICs, etched resistors, circuit patterns, and platedthrough vias to form a SMD module that requires no additi...
Description 2-WAY POWER DIVIDERS

File Size 131.63K  /  5 Page

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    MASW-003103-13645P MASW-003103-001SMB MASW-003103-1364V2

M/A-COM Technology Solutions, Inc.
Part No. MASW-003103-13645P MASW-003103-001SMB MASW-003103-1364V2
OCR Text ...s patented hmic? (heterolithic microwave integrated circui t) process, us patent 5,268,310. this process a llows the incorporation of si...millimeter frequencies. selective backside metalization is applied producing a surface mount dev...
Description HMICTM Silicon PIN Diode SP3T Switch

File Size 318.47K  /  8 Page

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    MA4SW410B-1 MA4SW410B-1V4

M/A-COM Technology Solutions, Inc.
Part No. MA4SW410B-1 MA4SW410B-1V4
OCR Text ...olutions hmic tm (heterolithic microwave integrated circuit) process, us patent 5,268,310. this process allows the incorporation of silic...millimeter frequencies. large bond pads facilitate the use of low inductance ribbon bonds, while go...
Description HMIC?/a> Silicon PIN Diode Switch

File Size 778.03K  /  6 Page

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    MASW-003102-13590G MASW-002102-13590W MASW-003102-13590W MASW-002102-13580G MASW-002102-13580V5

M/A-COM Technology Solutions, Inc.
Part No. MASW-003102-13590G MASW-002102-13590W MASW-003102-13590W MASW-002102-13580G MASW-002102-13580V5
OCR Text ...lutions hmic tm (heterolithic microwave integrated circuit) process, us patent 5,268,310. this process allows the incorporation of sili...millimeter frequencies. large bond pads facilitate the use of low inductance ribbon bonds, while g...
Description HMIC Silicon PIN Diode Switches

File Size 149.23K  /  7 Page

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For microwave millimeter Found Datasheets File :: 340    Search Time::1.75ms    
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