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TriQuint Semiconductor, Inc.
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Part No. |
TGA1073A-SCC TGA1073A-SCC-15
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OCR Text |
...exhaust is a safety concern. microwave or radiant curing should not be used because of differential heating. coefficient of thermal expansion matching is critical. interconnect process assembly notes: thermosonic ball bonding is th... |
Description |
26 35 GHz Medium Power Amplifier
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File Size |
125.59K /
7 Page |
View
it Online |
Download Datasheet
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TriQuint Semiconductor, Inc.
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Part No. |
TGA1073C-SCC TGA1073C-SCC-15
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OCR Text |
...exhaust is a safety concern. microwave or radiant curing should not be used because of differential heating. coefficient of thermal expansion matching is critical. interconnect process assembly notes: thermosonic ball bonding is th... |
Description |
36 40 GHz Power Amplifier
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File Size |
316.19K /
6 Page |
View
it Online |
Download Datasheet
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Price and Availability
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