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  TIM-5510 Datasheet PDF File

For TIM-5510 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

   
Part No. TIM7785-16UL
Description X BAND, GaAs, N-CHANNEL, RF POWER, MOSFET

File Size 119.73K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-T1109LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 9 Positions, 2.54 mm Pitch, Right Angle
Tech specs    

Official Product Page

HUA FENG CIRCUIT





   
Part No. TIM5053-35SL
Description C BAND, GaAs, N-CHANNEL, RF POWER, JFET

File Size 255.68K  /  4 Page

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Amphenol Communications Solutions

Part No. 55102-G1110LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 20 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TOSHIBA[Toshiba Semiconductor]
Part No. TIM7785-60SL
Description MICROWAVE POWER GaAs FET

File Size 79.91K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-T1108LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 8 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TIM7785-25UL

Toshiba Semiconductor
Part No. TIM7785-25UL
Description HIGH POWER P1dB=44.5dBm at 7.7GHz to 8.5GHz

File Size 116.96K  /  4 Page

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Part No. 55101-G17-04
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 4 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    Toshiba, Corp.
TOSHIBA[Toshiba Semiconductor]
Part No. TIM7785-35SL
Description MICROWAVE POWER GaAs FET 微波功率GaAs场效应管

File Size 176.25K  /  5 Page

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Amphenol Communications Solutions

Part No. 55101-T1104LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 4 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TOSHIBA[Toshiba Semiconductor]
Part No. TIM7785-30SL
Description MICROWAVE POWER GaAs FET

File Size 164.17K  /  5 Page

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Amphenol Communications Solutions

Part No. 55101-T1113LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 13 Positions, 2.54 mm Pitch, Right Angle
Tech specs    

Official Product Page

    TOSHIBA[Toshiba Semiconductor]
Part No. TIM4450-35SL
Description MICROWAVE POWER GaAs FET

File Size 97.20K  /  4 Page

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Amphenol Communications Solutions

Part No. 55102-G1703LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 6 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TOSHIBA[Toshiba Semiconductor]
Part No. TIM6472-45SL
Description MICROWAVE POWER GaAs FET

File Size 506.76K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-S3620LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 20 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TOSHIBA[Toshiba Semiconductor]
Part No. TIM6472-35SL
Description MICROWAVE POWER GaAs FET

File Size 133.13K  /  4 Page

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Amphenol Communications Solutions

Part No. 55102-T17-22
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 44 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TOSHIBA[Toshiba Semiconductor]
Part No. TIM6472-30SL
Description MICROWAVE POWER GaAs FET

File Size 132.10K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-G1715LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 15 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

For TIM-5510 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

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