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For unlabeled Found Datasheets File :: 409 Search Time::1.454ms
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				Simtek Corporation
Part No.	STK14D88-NF25 STK14D88-NF25I STK14D88-NF25ITR STK14D88-NF25TR STK14D88-NF35 STK14D88-NF35I STK14D88-NF35ITR STK14D88-NF35TR STK14D88-NF45 STK14D88-NF45I
OCR Text	...latile storage elements. Ground unlabeled pins have no internal connections. VCAP VSS (Blank) Power Supply Power Supply No Connect Document Control #ML0033 Rev 2.0 Jan 2008 2 SSOP STK14D88 ABSOLUTE MAXIMUM RATINGSa Volta...
Description	32Kx8 Autostore nvSRAM
File Size	272.13K / 20 Page	View it Online	Download Datasheet

				Simtek Corporation
Part No.	STK17TA8-RF25 STK17TA8-RF25I STK17TA8-RF25ITR STK17TA8-RF25TR STK17TA8-RF45 STK17TA8-RF45I STK17TA8-RF45ITR STK17TA8-RF45TR
OCR Text	...latile storage elements. Ground unlabeled pins have no internal connections. INT VCAP VSS (Blank) Output Power Supply Power Supply No Connect Document Control #ML0025 Rev 2.0 Jan, 2008 2 SSOP STK17TA8 ABSOLUTE MAXIMUM RAT...
Description	128Kx8 Autostore nvSRAM With Real-Time Clock
File Size	331.25K / 29 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-ALH244
OCR Text	... 6. CONNECTION NOT REQUIRED FOR unlabeled BOND PADS. 7. OVERALL DIE SIZE .002" [1] Refer to the "Packaging Information" section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. ...
Description	GaAs HEMT MMIC LOW NOISE AMPLIFIER, 24 - 40 GHz
File Size	182.30K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-ALH3761
OCR Text	... 6. CONNECTION NOT REQUIRED FOR unlabeled BOND PADS. 7. OVERALL DIE SIZE .002" [1] Refer to the "Packaging Information" section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. ...
Description	GaAs HEMT MMIC LOW NOISE AMPLIFIER, 35 - 45 GHz
File Size	169.53K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-ALH382
OCR Text	... 6. CONNECTION NOT REQUIRED FOR unlabeled BOND PADS. 7. OVERALL DIE SIZE .002" [1] Refer to the "Packaging Information" section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. ...
Description	GaAs HEMT LOW NOISE AMPLIFIER, 57 - 65 GHz
File Size	171.38K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-APH462
OCR Text	... 6. CONNECTION NOT REQUIRED FOR unlabeled BOND PADS. 7. OVERALL DIE SIZE .002" [1] Refer to the "Packaging Information" section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. ...
Description	GaAs HEMT MMIC 1 WATT POWER AMPLIFIER, 15 - 27 GHz
File Size	232.68K / 6 Page	View it Online	Download Datasheet

				Simtek Corporation
Part No.	STK14CA8-NF45 STK14CA8-NF45I STK14CA8-NF25 STK14CA8-NF25I STK14CA8-NF25ITR STK14CA8-NF25TR STK14CA8-NF35 STK14CA8-NF35I STK14CA8-NF35ITR STK14CA8-NF35TR
OCR Text	...latile storage elements. Ground unlabeled pins have no internal connections. VCAP VSS NC Power Supply Power Supply No Connect Document Control #ML0022 Rev 2.1 Jan, 2008 2 SSOP DQ3 VCC SOIC STK14CA8 ABSOLUTE MAXIMUM ...
Description	128Kx8 Autostore nvSRAM
File Size	278.58K / 21 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-ALH445
OCR Text	... 6. CONNECTION NOT REQUIRED FOR unlabeled BOND PADS. 7. OVERALL DIE SIZE .002" [1] Refer to the "Packaging Information" section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. ...
Description	GaAs HEMT MMIC LOW NOISE AMPLIFIER, 18 - 40 GHz
File Size	240.84K / 6 Page	View it Online	Download Datasheet

				Peregrine Semiconductor Corp.
Part No.	EK-42641-01 PE42641 PE42641MLI PE42641MLI-Z
OCR Text	...ough Line J7 SMASM 1 2 unlabeled Test Line (c)2007-8 Peregrine Semiconductor Corp. All rights reserved. Page 4 of 9 Document No. 70-0216-05 UltraCMOSTM RFIC Solutions 2 PE42641 Product Specification Figure 6. Inser...
Description	SP4T UltraCMOS RF Switch DC - 3.0 GHz
File Size	303.53K / 9 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-ABH2410712
OCR Text	... 6. CONNECTION NOT REQUIRED FOR unlabeled BOND PADS. 7. OVERALL DIE SIZE .002" [1] Refer to the "Packaging Information" section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. ...
Description	GaAs HEMT MMIC MEDIUM POWER AMPLIFIER, 50 - 66 GHz
File Size	216.97K / 6 Page	View it Online	Download Datasheet

For unlabeled Found Datasheets File :: 409 Search Time::1.454ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |